Entropy engineering induced exceptional thermoelectric and mechanical performances in Cu2-Ag Te1-2S Se

Zhang, Zixun; Zhao, Keli; Chen, Heyang; Ren, Qingyong; Yue, Zhongmou; Wei, Tian‐Ran; Qiu, Pengfei; Chen, Lidong; Shi, Xun

doi:10.1016/j.actamat.2021.117512

Cited by 46 publications

(38 citation statements)

References 61 publications

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“…Zhang et al demonstrated that entropy engineering could be exploited to simultaneously yield both good thermoelectric performance and robust mechanical properties in quinary alloys (Ag y Cu 2− y Te 1−2 x S x Se x ). [ 119 ] The coalloying of S/Se/Ag in Cu 2 Te simultaneously stabilizes a high‐symmetry hexagonal structure, extends the solubility limit of Ag, and reduces the phase transition temperature on account of increased configurational entropy. As a result, the carrier concentration is largely decreased while the effective mass is improved, contributing to a higher Seebeck coefficient and power factor.…”

Section: Multinary Silver‐based Chalcogenidesmentioning

confidence: 99%

Thermoelectric Silver‐Based Chalcogenides

et al. 2022

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Heat is abundantly available from various sources including solar irradiation, geothermal energy, industrial processes, automobile exhausts, and from the human body and other living beings. However, these heat sources are often overlooked despite their abundance, and their potential applications remain underdeveloped. In recent years, important progress has been made in the development of high-performance thermoelectric materials, which have been extensively studied at medium and high temperatures, but less so at near room temperature. Silver-based chalcogenides have gained much attention as near room temperature thermoelectric materials, and they are anticipated to catalyze tremendous growth in energy harvesting for advancing internet of things appliances, self-powered wearable medical systems, and self-powered wearable intelligent devices. This review encompasses the recent advancements of thermoelectric silver-based chalcogenides including binary and multinary compounds, as well as their hybrids and composites. Emphasis is placed on strategic approaches which improve the value of the figure of merit for better thermoelectric performance at near room temperature via engineering material size, shape, composition, bandgap, etc. This review also describes the potential of thermoelectric materials for applications including self-powering wearable devices created by different approaches. Lastly, the underlying challenges and perspectives on the future development of thermoelectric materials are discussed.

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Section: Multinary Silver‐based Chalcogenidesmentioning

confidence: 99%

Thermoelectric Silver‐Based Chalcogenides

et al. 2022

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“…In addition, the maximum conversion efficiency is remarkable (12.3% at 507 K temperature difference), which is due to the high configuration entropy stabilizing the phase structure and electron transport capability, while the severe lattice distortion strongly scatters phonons, thereby greatly reducing the lattice thermal conductivity. “High-entropy engineering” can not only improve the thermoelectric properties of multi-principal thermoelectric materials but also improve their mechanical properties [ 65 , 66 ]. For example, the zT values of Cu 2- y Ag y Te 1-2 x S x Se x (0 ≤ x ≤ 0.3, 0 ≤ y ≤ 0.1) multi-principal component thermoelectric materials are 2.5 times higher than that of Cu 2 Te-based material.…”

Section: Toughening Strategies Of Thermoelectric Materialsmentioning

confidence: 99%

“…For example, the zT values of Cu 2- y Ag y Te 1-2 x S x Se x (0 ≤ x ≤ 0.3, 0 ≤ y ≤ 0.1) multi-principal component thermoelectric materials are 2.5 times higher than that of Cu 2 Te-based material. Besides, the compressive strength is significantly increased by nearly 5 times and even induces prominent plastic deformation, which is owing to the lattice distortion hindering the movement of dislocations, showing strong solid solution strengthening [ 66 ].…”

Section: Toughening Strategies Of Thermoelectric Materialsmentioning

confidence: 99%

“…( a ) Enhanced configurational entropy with increasing components in multicomponent thermoelectric materials [ 65 ]; The thermoelectric figure of merit ( b ) and conversion efficiency as a function of temperature difference ( c ) of Pb 0.89 Sb 0.012 Sn 0.1 Se 0.5 Te 0.25 S 0.25 six-component thermoelectric materials [ 65 ] (Reprinted with permission from ref [ 65 ]. Copyright 2021 American Association for the Advancement of Science); The thermoelectric figure of merit ( d ) and stress-strain curves ( e ) of Cu 2- y Ag y Te 1−2 x S x Se x (0 ≤ x ≤ 0.3, 0 ≤ y ≤ 0.1) multicomponent thermoelectric materials (Reprinted with permission from ref [ 66 ]. Copyright 2022 Elsevier).…”

Section: Figurementioning

confidence: 99%

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Toughening Thermoelectric Materials: From Mechanisms to Applications

Feng

Cao

et al. 2023

IJMS

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With the tendency of thermoelectric semiconductor devices towards miniaturization, integration, and flexibility, there is an urgent need to develop high-performance thermoelectric materials. Compared with the continuously enhanced thermoelectric properties of thermoelectric materials, the understanding of toughening mechanisms lags behind. Recent advances in thermoelectric materials with novel crystal structures show intrinsic ductility. In addition, some promising toughening strategies provide new opportunities for further improving the mechanical strength and ductility of thermoelectric materials. The synergistic mechanisms between microstructure-mechanical performances are expected to show a large set of potential applications in flexible thermoelectric devices. This review explores enlightening research into recent intrinsically ductile thermoelectric materials and promising toughening strategies of thermoelectric materials to elucidate their applications in the field of flexible thermoelectric devices.

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“…Recently, copper-based diamond-like compounds with a distorted tetrahedral structure that are derived from the binary-cubic sphalerite structure through cation-substitution and the expansion of the unit cell have attracted great interest in the TE field. 10,[29][30][31][32][33][34][35][36][37][38][39][40][41][42][43][44] Among a large number of compounds in this family, Cu 3 SbSe 4 with a narrow band gap of 0.4 eV exhibits independently tunable electrical and thermal transport properties. [45][46][47] Nevertheless, the TE performance of Cu 3 SbSe 4 is currently restricted by its relatively low electrical conductivity and high lattice thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%