Ensemble Meta-Learning-Based Robust Chipping Prediction for Wafer Dicing
Bao Rong Chang,
Hsiu-Fen Tsai,
Hsiang-Yu Mo
Abstract:Our previous study utilized importance analysis, random forest, and Barnes–Hut t-SNE dimensionality reduction to analyze critical dicing parameters and used bidirectional long short-term memory (BLSTM) to predict wafer chipping occurrence successfully in a single dicing machine. However, each dicing machine of the same type may produce unevenly distributed non-IID dicing signals, which may lead to the undesirable result that a pre-trained model trained by dicing machine #1 could not effectively predict chippin… Show more
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