Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route

Babaghorbani, P.; Gupta, Manoj

doi:10.1007/s11664-008-0399-2

Cited by 19 publications

(23 citation statements)

References 26 publications

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“…Large and long pores exist in conventionally sintered sample plus nearly rounded ones indicated by arrows, whereas only rounded pores presented in the microwavesintered counterpart. It is worthy of mention that the improvement of pore structure under microwave sintering is a common advantage, repeatedly revealed in related studies [14,24]. In addition, it is interesting to note that microwave sintering efficiently depresses the aggregation of W grains, revealed by the SEM imaging shown in Fig.…”

Section: Resultsmentioning

confidence: 53%

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Microwave sintering W–Cu composites: Analyses of densification and microstructural homogenization

Luo

Guo

et al. 2009

Journal of Alloys and Compounds

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Section: Resultsmentioning

confidence: 53%

“…This result is evidently inconsistent with the usual opinion-microwave sintering depressing microstructural coarsening. In fact, the depression effect is mostly originated from shortened holding time at sintering temperature [24,25]. Identical sintering conditions probably lead to an opposite conclusion, as proved in alumina case [26].…”

Section: Resultsmentioning

confidence: 92%

Microwave sintering W–Cu composites: Analyses of densification and microstructural homogenization

Luo

Guo

et al. 2009

Journal of Alloys and Compounds

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Section: Fabrication Methods Of Reinforced Soldersmentioning

confidence: 99%

“…Then the solder mixture was melted on a heating plate to obtain the reinforced solder. In addition, the powder metallurgy method could be used by mixing the solder alloy powder with reinforcement particles which were reported on in several studies [10, 26, 30, 31, 36,[74][75][76][77][78][79].The powder metallurgy method consists of several steps which include mixing, forming and sintering as in microwave heating results in a homogenous fine microstructure and reduces the porosity which may translate into increased solder reliability.Both conventional and microwave sintering are normally conducted with the aid of inert gas, such as argon or nitrogen, to eliminate oxidation [82]. The sintering procedure is used to fuse particles by solid-state bonding where the melted particle will cover the unmelted particles.…”

mentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

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“…The sample is kept in a ceramic crucible and SiC susceptor blocks were placed around the samples to provide sufficient heating up from room temperature. The SiC susceptors can also provide radiative heating to the samples [4]. The experiments were carried out under nitrogen atmosphere.…”

Section: Methodsmentioning

confidence: 99%

Microstructure and mechanical properties of microwave sintered austenitic stainless steel

Kennedy

Kumaran

Rao

2011

Trans Indian Inst Met

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The objective of this work is focused on understanding the effect of microwave heating on sintering of 316L powders. The stainless steel samples were prepared from prealloyed powders of 316L. The powder samples were compacted at a pressure of 560 MPa and sintered at 1300ºC in a microwave furnace of 2.4 GHz and 2KW capacity in nitrogen atmosphere. The sintering time was varied from 10 to 20 minutes in order to study the effect of sintering time on sintering behavior and mechanical properties of the sintered samples. The sintered samples were subjected to optical metallography, hardness testing, tensile testing and fractogrphy. The average density of sintered stainless steels was 92% of the theoretical density, approximately 18% increment from green density for 20 min. sintering time. Microstructural analysis showed the regularly distributed porosity with very small grains. The hardness value was in the range of 365VHN to 396VHN and tensile strength, in the range of 255MPa to 580 MPa. Fractographs for these steels revealed mixed mode of fracture.

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Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route

Cited by 19 publications

References 26 publications

Microwave sintering W–Cu composites: Analyses of densification and microstructural homogenization

Microwave sintering W–Cu composites: Analyses of densification and microstructural homogenization

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Microstructure and mechanical properties of microwave sintered austenitic stainless steel

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