Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model

Li, Y.L.; Figueroa, D.G.; Chickamenahalli, S.A.; Chung, Chee Yee; Yew, Teong Guan; Cornelius, M.D.; Do, Huong

doi:10.1109/ectc.2000.853162

Cited by 16 publications

(3 citation statements)

References 12 publications

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“…One such library is PoseNet, which is part of TensorFlow.js, and it offers an accurate and efficient convolutional neural net-work (CNN) [17] for estimating the user's position and pose. This information is then utilized in combination with the three.js library to animate a 3D VRM model [21] of clothing, ensuring it aligns with the user's pose as determined by PoseNet.…”

Section: Discussionmentioning

confidence: 99%

Virtual Wardrobe using Augmented Reality

Verma,

Sharma,

Chaudhary

et al. 2024

Advancements in Communication and Systems

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The Virtual Wardrobe [18] represents an innovative breakthrough poised to revolutionize the global fashion landscape, offering the potential to usher in highly advantageous changes to the industry. This application provides users worldwide with the ability to engage with the latest fashion trends, discover the perfect garments to enhance their wardrobes, all while significantly economizing both time and finances when selecting the right outfit. One of the distinguishing features of this application is its capacity to create a three-dimensional representation of an individual, leveraging existing two-dimensional product im-ages to construct an immersive augmented reality environment[19], allowing users to make informed outfit choices without the need for physical try-ons. The inclusion of user-profiles empowers users to maintain their entire wardrobe digitally, thereby enabling highly personalized clothing recommendations[20]. Furthermore, the integration of social sharing functionalities fosters user engagement and promotes exploration of the world of fashion. This platform boasts an intuitive interface and a state-of-the-art technology stack, positioning it to redefine the way individuals perceive and interact with fashion. It equips users with the means to stay current with fashion trends while mitigating the waste of time and financial resources, rendering style accessible and enjoyable for a global audience.

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Section: Discussionmentioning

confidence: 99%

Virtual Wardrobe using Augmented Reality

Verma,

Sharma,

Chaudhary

et al. 2024

Advancements in Communication and Systems

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“…On the other hand, parasitic inductance is difficult to determine. Sometimes, inductance is tweaked so that the PDN-impedance matches well with measurement but there been no report of doing it systematically [5], [6]. Fitted inductance in one design does not necessary provide the best fit in others.…”

Section: Introductionmentioning

confidence: 95%

Substrate-geometry aware 2-port modeling for surface-mount passive components

Yamanaga

Satō

Masu

2008

2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compati

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Electrical modeling methodology for surface-mount passive components is proposed. In order to accurately capture parasitic inductance, the proposed 2-port model accounts for surrounding ground layer configurations of the print circuit board (PCB) on which the component is mounted. Our model retains conventional modeling paradigm in which component suppliers provide their customers with simulation models characterized independently of the customers' PCB. We also present necessary corrections that compensate missing magnetic coupling between the models. Impedance of a power distribution network is experimentally analyzed being non-separated modeling as the reference. The proposed model achieved very good match with the reference result reducing 10-30% error of the conventional model to within 1%.

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“…Power noise simulations are essential in the early development phase of chip and package design. For mid-frequency decoupling optimization the power distribution of the entire package with capacitors and all parasitic inductances must be simulated [3], [4], [SI. In this paper SPEED2000 from Sigrity Inc. has been used for the simulations [6].…”

Section: Introductionmentioning

confidence: 99%

Package and chip design optimization for mid-frequency power distribution decoupling

Garben

Katopis²,

Becker³

Electrical Performance of Electronic Packaging,

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In this paper the mid-frequency power supply noise has been studied for a complex, next generation computer system by simulations of the complete module and board power distribution system. An MCM-D and MCM-C design and the effectiveness of on-chip and discrete on-module decoupling capacitors have been compared. The impact of delta-I ramping over several cycles and the impact of the continuous background switching and on-chip leakage have been analyzed. Conclusions are presented to optimize the chip and package design. IntroductionIt is of increasing importance to contain the mid-frequency power noise caused by on-chip switching activity variations, because of tighter supply voltage tolerances due to decreasing operating voltage and shorter cycle times, and because of faster and larger current transients due to increasing switching frequency, chip current, and extensive clock gating [ 11, [2]. Therefore low impedance power delivery and optimized decoupling is mandatory. Power noise simulations are essential in the early development phase of chip and package design. For mid-frequency decoupling optimization the

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Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model

Cited by 16 publications

References 12 publications

Virtual Wardrobe using Augmented Reality

Virtual Wardrobe using Augmented Reality

Substrate-geometry aware 2-port modeling for surface-mount passive components

Package and chip design optimization for mid-frequency power distribution decoupling

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