Enhancing Mechanical and Thermal Properties of 3D-Printed Samples Using Mica-Epoxy Acrylate Resin Composites—Via Digital Light Processing (DLP)

Abstract

Digital light processing (DLP) techniques are widely employed in various engineering and design fields, particularly additive manufacturing. Acrylate resins utilized in DLP processes are well known for their versatility, which enables the production of defect-free 3D-printed products with excellent mechanical properties. This study aims to improve the mechanical and thermal properties of 3D-printed samples by incorporating mica as an inorganic filler at different concentrations (5%, 10%, and 15%) and optimizing the dispersion by adding a KH570 silane coupling agent. In this study, mica was introduced as a filler and combined with epoxy acrylate resin to fabricate a 3D-printed sample. Varying concentrations of mica (5%, 10%, and 15% w/w) were mixed with the epoxy acrylate resin at a concentration of 10%, demonstrating a tensile strength increase of 85% and a flexural strength increase of 132%. Additionally, thermal characteristics were analyzed using thermogravimetric analysis (TGA), and successful morphological investigations were conducted using scanning electron microscopy (SEM). Digital light-processing technology was selected for its printing accuracy and cost-effectiveness. The results encompass comprehensive studies of the mechanical, thermal, and morphological aspects that contribute to the advancement of additive manufacturing technology.