2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00194
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Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating

Dinesh Kumar Kumaravel,
Kevin Antony Jesu Durai,
Shyam M Nair
et al.
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