Enhancement of the micromachining capabilities of CO2 planar waveguide lasers

Villarreal, Francisco; Murray, P. R.; Cao, Q.; Field, P. A.; Markillie, G.A.J.; Baker, H. J.; Hall, D. R.

doi:10.2351/1.5059305

Cited by 2 publications

(2 citation statements)

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“…Improved processing capability with such lasers has been shown in a number of cases including: in electronics manufacturing for the laser drilling of microvias in organic materials such as FR4, [7] for drilling of copper coated substrates [14] and for ceramic substrate processing [13]; in surface treatment of aluminium alloys for aerospace applications by controlled surface melting to produce increased conosion resistance, particularly in welded sections [15]and for micro-machining of micro-optics [16,17]. The USP planar waveguide laser as a compact, sealed laser which combines high average power with high peak power and short pulses at highly controllable kHz repetition rates is a strong candidate for use in table-top and larger laser systems for applications for micro-machining in electronics and photonics packaging and in other precision manufacturing industries.…”

Section: Resonatormentioning

confidence: 99%

<title>High-power RF-excited planar waveguide carbon dioxide lasers for microprocessing applications</title>

2003

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We review progress in the development of a novel mode of operation of the planar waveguide carbon dioxide laser (referred to as the ultra-super-pulse or USP mode), which is capable of delivering, at high efficiency, up to ten times higher peak power and up to ten times shorter pulse duration than the 'conventional' planar waveguide laser. These enhanced bream properties extend the range of applications to micro-processing of materials with higher machining threshold and/or low absorption coefficients and with the added advantage ofproducing reduced heat affected zone.

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Section: Resonatormentioning

confidence: 99%

<title>High-power RF-excited planar waveguide carbon dioxide lasers for microprocessing applications</title>

2003

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“…However in the pulse length T=20-50 ts region, the heat penetration depth (4icT)V, calculated with the typical values of thermal diffusivity i for poor thermal conductors is often comparable to the absorption depth ofthe incident light. As an example of this, we have reported experiments on ablation of silica glass in which material removal by evaporation can be maximised at pulse lengths in the 20 to 30 .ts range [1]. This avoids an explosive melt-ejection process caused by the higher ablation pressure with shorter pulses.…”

Section: Introductionmentioning

confidence: 97%