Enhancement of Surface-Damage Resistance by Removing Subsurface Damage in Fused Silica and Its Dependence on Wavelength

Kamimura, Tomosumi; Akamatsu, Shigenori; Horibe, Hideo; Shiba, Haruya; Motokoshi, Shinji; Sakamoto, T.; Jitsuno, Takahisa; Okamato, Takayuki; Yoshida, Kunio

doi:10.1143/jjap.43.l1229

Cited by 25 publications

(16 citation statements)

References 8 publications

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“…A major attribute of optical fabrication is connected with the management and control of surface or near-surface imperfections and fractures [1][2][3][4][5][6] . Incorrect data or awareness on these kinds of artifacts typically leads to lower quality products and a constant struggle with high rework rates.…”

Section: Introductionmentioning

confidence: 99%

Utilization of magnetorheological finishing as a diagnostic tool for investigating the three-dimensional structure of fractures in fused silica

Menapace¹,

Davis²,

Steele³

et al. 2005

SPIE Proceedings

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We have developed an experimental technique that combines magnetorheological finishing (MRF) and microscopy to examine fractures and/or artifacts in optical materials. The technique can be readily used to provide access to, and interrogation of, a selected segment of a fracture or object that extends beneath the surface. Depth slicing, or cross-sectioning at selected intervals, further allows the observation and measurement of the three-dimensional nature of the sites and the generation of volumetric representations that can be used to quantify shape and depth, and to understand how they were created, how they interact with surrounding material, and how they may be eliminated or mitigated.

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Section: Introductionmentioning

confidence: 99%

Utilization of magnetorheological finishing as a diagnostic tool for investigating the three-dimensional structure of fractures in fused silica

Menapace¹,

Davis²,

Steele³

et al. 2005

SPIE Proceedings

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“…Figure 1 depicts a diagram of the 266 nm laser irradiation system 15 for removal of the resist coated on the Si wafer. The resist surface was irradiated with a 266 nm beam (pulse width = 4 ns) by using an f ¼ 100 mm lens under atmosphere or under a vacuum (0.02 Torr).…”

Section: Nm Laser Irradiation Systemmentioning

confidence: 99%

Removal of Diazonaphthoquinone/Novolak Resist Using UV Laser (266 nm)

Horibe

Kamimura

Hata

et al. 2005

Polym J

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ABSTRACT:This study revealed a promising method for removing positive-tone diazonaphthoquinone/novolak resist. The fourth harmonic of an Nd 3þ :YAG (Y 3 Al 5 O 12 ) pulsed laser (266 nm) was irradiated onto the resist. Resist was removed when laser power exceeded 35 mJ/cm 2 , and a 250 nm-thick resist was removed with a laser power of 94 mJ/cm 2 . X-ray Photoelectron Spectroscopy (XPS) proved that 1100 nm-thick resist could be completely removed from a Si surface when it was irradiated almost 700 mJ/cm 2 . The resist onto three inch Si wafer (45.58 mm 2 ) was removed in two minutes by laser. No damage to the processed Si wafer could be detected by optical microscopic observation. This method is good for environment.

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“…Brittle grinding processes induce fractures at, or near, an optical surface whose range can extend from depths of a few µm to hundreds of µm [1][2][3][4][5] . These process-induced or process-related fractures not only determine the current state of the optic in the fabrication process, they dictate how much material needs to be removed during subsequent steps [6][7][8] .…”

Section: Introductionmentioning

confidence: 99%

MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique

et al. 2005

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Understanding the behavior of fractures and subsurface damage in the processes used during optic fabrication plays a key role in determining the final quality of the optical surface finish. During the early stages of surface preparation, brittle grinding processes induce fractures at or near an optical surface whose range can extend from depths of a few µm to hundreds of µm depending upon the process and tooling being employed. Controlling the occurrence, structure, and propagation of these sites during subsequent grinding and polishing operations is highly desirable if one wishes to obtain high-quality surfaces that are free of such artifacts. Over the past year, our team has made significant strides in developing a diagnostic technique that combines magnetorheological finishing (MRF) and scanning optical microscopy to measure and characterize subsurface damage in optical materials. The technique takes advantage of the unique nature of MRF to polish a prescribed large-area wedge into the optical surface without propagating existing damage or introducing new damage. The polished wedge is then analyzed to quantify subsurface damage as a function of depth from the original surface. Large-area measurement using scanning optical microscopy provides for improved accuracy and reliability over methods such as the COM ball-dimple technique. Examples of the technique's use will be presented that illustrate the behavior of subsurface damage in fused silica that arises during a variety of intermediate optical fabrication process steps.

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Enhancement of Surface-Damage Resistance by Removing Subsurface Damage in Fused Silica and Its Dependence on Wavelength

Cited by 25 publications

References 8 publications

Utilization of magnetorheological finishing as a diagnostic tool for investigating the three-dimensional structure of fractures in fused silica

Utilization of magnetorheological finishing as a diagnostic tool for investigating the three-dimensional structure of fractures in fused silica

Removal of Diazonaphthoquinone/Novolak Resist Using UV Laser (266 nm)

MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique

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