2018
DOI: 10.1016/j.solmat.2017.10.004
|View full text |Cite
|
Sign up to set email alerts
|

Enhancement of silicon-wafer solar cell efficiency with low-cost wrinkle antireflection coating of polydimethylsiloxane

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
22
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 41 publications
(22 citation statements)
references
References 41 publications
0
22
0
Order By: Relevance
“…We also proposed silicone encapsulation to improve efficiency as we increased the AOI. In particular, the casting‐based process with silicone encapsulation is suitable for 3‐D module fabrication because it is difficult to apply the hot‐press lamination process to complex‐shaped cell arrays. Through this process, we aimed to realize the full potential of cell performance at the module level.…”
Section: Introductionmentioning
confidence: 99%
“…We also proposed silicone encapsulation to improve efficiency as we increased the AOI. In particular, the casting‐based process with silicone encapsulation is suitable for 3‐D module fabrication because it is difficult to apply the hot‐press lamination process to complex‐shaped cell arrays. Through this process, we aimed to realize the full potential of cell performance at the module level.…”
Section: Introductionmentioning
confidence: 99%
“…Wrinkles are wavy physical structures with periodicity that can impart flexibility to optoelectronic devices and control the optical path through a material stack. Therefore, they are widely utilized to enhance the properties of optoelectronic devices [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 ]. Rogers et al reported that the characteristics of transistors and photodetectors can be preserved during device bending by transforming the rigid silicon structure into a wavy wrinkle structure [ 1 ].…”
Section: Introductionmentioning
confidence: 99%
“…Formation of buckles (wrinkles) on a thin film attached to a compliant substrate has received considerable attention due to the advancement of flexible electronics, [1][2][3][4][5] optoelectronics and photovoltaics, [6][7][8][9][10][11] and various functional devices, [12][13][14][15][16] as well as the development of self-organizing mechanisms. [17][18][19][20][21] Buckling can be triggered by direct application of an in-plane compressive strain, as schematically shown in Figure 1(a).…”
Section: Introductionmentioning
confidence: 99%