Enhancement of Selectivity for Chemical Mechanical Polishing by Ultra-High-Dose C and Si Ion Implantation
S. Yuan,
K. Omori,
T. Yamaguchi
et al.
Abstract:The selectivity of chemical mechanical polishing (CMP) is successfully enhanced due to the modification of the film surface by ultra-high-dose ion implantation for the first time. The removal rate (RR) of CMP for SiO2 and Si3N4 films was changed by implanted ions. On the other hand, polycrystalline silicon (poly-Si) films had no change regardless of ion implantation. When C + is implanted at 3×10 16 ions/cm 2 into SiO2, the RR decreases by about 40% compared with that without implantation. However, no signific… Show more
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