Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers

Chen, Sung-Te; Chung, Yu-Cheng; Fang, Jau–Shiung; Cheng, Yi-Lung; Chen, Giin-Shan

doi:10.1016/j.apsusc.2017.02.027

Cited by 11 publications

(6 citation statements)

References 45 publications

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“…While the method required oxidation of substrates not bearing surface hydroxyl sites to enable SAM chemisorption, the use of amine ligand functional groups ,− eliminated the need for environmentally hazardous Sn species. Direct covalent binding of Pd species by the ligands facilitated deposition of adherent EL metal films without the need for substrate surface roughening, permitting fabrication of sub-100 nm features in EL metal. − More recently, others have improved the ligand-based process by replacing costly Pd species by cheaper first row transition metal ions, such as Co, ,, Cu, − or Ni, ,,− capable of autocatalyzing EL metal deposition upon reduction to zerovalent species. Some examples have been presented in the Cobalt section, Nickel section, and Copper section.…”

Section: Discussionmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: Discussionmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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“…In addition to the need of lower resistivity, the other requirement for Cu film is to fill the high aspect ratio vias and trenches without voids in the dual damascene structure. After continuous research and development for many years, Cu film can now be deposited by various technologies, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), laser reflow, atomic layer deposition (ALD), and plating (electrolytic and electroless) [28][29][30][31][32][33]. sputtering methods belong to PVD technology, which can provide a lower resistivity as compared to other technologies.…”

Section: Copper Deposition Methodsmentioning

confidence: 99%

Copper Metal for Semiconductor Interconnects

Cheng¹,

Lee²,

Huang³

2018

Noble and Precious Metals - Properties, Nanoscale Effects and Applications

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Resistance-capacitance (RC) delay produced by the interconnects limits the speed of the integrated circuits from 0.25 mm technology node. Copper (Cu) had been used to replace aluminum (Al) as an interconnecting conductor in order to reduce the resistance. In this chapter, the deposition method of Cu films and the interconnect fabrication with Cu metallization are introduced. The resulting integration and reliability challenges are addressed as well.

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“…The chemical copper plating process generally involves three steps: the modification of flexible substrates, the reduction of catalytic seeds, and the growth of copper microcircuits. 16,18,24–26 Chen et al 27 modified polyimide (PI) films using a strong alkaline solution, and subsequently printed Cu( ii ) ink and reductive ink respectively to form copper nanoparticle catalytic patterns. As a result, high-quality flexible copper microcircuits were obtained after chemical growth.…”

Section: Introductionmentioning

confidence: 99%