“…0.4 up to 0.7 W/(m·K) [13][14][15][16][17][18][19], makes it difficult to utilize this capacity effectively. To enhance the heat transfer into PCMs, various techniques have been suggested, like fins [17,[20][21][22], metal and graphite-compound matrices [23][24][25], dispersed high-conductivity particles inside the PCM [26,27], and micro-encapsulation [28,29].…”