Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices

Guang, Zhang; Jiang, Shaohui; Yao, Wei; Liu, Changhong

doi:10.1021/acsami.6b08815

Cited by 37 publications

(19 citation statements)

References 54 publications

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“…A variety of heat dissipation approaches, including fin heat sink18–20 and materials phase change,21,22 have been applied to low down the operation temperature of the semiconductor devices. However, the low capacity of heat dissipation using these methods can hardly satisfy the requirements of high‐energy‐density devices 23,24. Radiative cooling technology is promising and can passively dissipate heat from Earth into outer space, but it is only notable at night and the application is limited in outdoor situations 25–27.…”

Section: Figurementioning

confidence: 99%

Promoting Energy Efficiency via a Self‐Adaptive Evaporative Cooling Hydrogel

et al. 2020

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of the temperature, quasi-Fermi levels of holes and electrons become closer to each other under some working conditions, [10,11] and the barrier height of the P-N junction decreases. [10] Moreover, the band gap of the P-N junction reduces and carrier transition from the valence band to conduction band becomes easier. [12,13] These effects bring adverse impacts on a variety of the energy conversion processes including photoelectric conversion, [14,15] electroluminescence, [16] voltage controlled tunneling, [10,17] and so on. Hence, efficiently dissipating the waste heat and maintaining the operation temperature at a low level is essentially important for the semiconductor devices to achieve efficient, reliable, and safe operations.A variety of heat dissipation approaches, including fin heat sink [18][19][20] and materials phase change, [21,22] have been applied to low down the operation temperature of the semiconductor devices. However, the low capacity of heat dissipation using these methods can hardly satisfy the requirements of high-energy-density devices. [23,24] Radiative cooling technology is promising and can passively dissipate heat from Earth into outer space, but it is only notable at night and the application is limited in outdoor situations. [25][26][27] Although active cooling devices such as forced air circulation [28,29] and hydro-cooling, [30,31] show high cooling performance, they have high energy consumptions and require complex auxiliary accessories (e.g., fans or water pumps). These limitations render them little adaptability in either large-scale or portable applications. Simply structured cooling technology with high capacity of heat dissipation remains a great challenge.Herein, we present a universal, simple, efficient, low-cost, and passive cooling strategy to adaptively low down the working temperature of the semiconductor devices. By using its evaporative cooling capability, a thin layer of lithium-and bromine enriched polyacrylamide (PAAm) hydrogel can efficiently dissipate the waste heat induced by nugatory carrier transport in the P-N junctions of a semiconductor device. When attaching the hydrogel onto the semiconductors, it will absorb the heat from the semiconductors, which results in the rising of the hydrogel temperature. And the water molecules will be released and quickly dissipate the waste heat into the ambient air due to the large latent heat of water. This can efficiently cool down the semiconductors for a better working efficiency. In the standby mode, the hydrogel can spontaneously harvest water from its High temperature brings adverse impacts on the energy efficiency, and even destroys a semiconductor device. Here, a novel and cost-effective strategy is proposed to boost the energy efficiency of semiconductor devices by using the self-adaptive evaporative cooling of a lithium-and bromine-enriched polyacrylamide hydrogel. Water inside the hydrogel can quickly evaporate to dissipate the waste heat generated by the nugatory carrier transport in the P-N junction. In dormancy,...

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Section: Figurementioning

confidence: 99%

Promoting Energy Efficiency via a Self‐Adaptive Evaporative Cooling Hydrogel

et al. 2020

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“…Contrary to the case of solid thin films, such a small portion of incoming light is absorbed by the EUV CNT core so its temperature is not expected to rise above ~230 o C. The introduction of active cooling in the scanner 18 will be able to generate interstitial flow of gas across the CNT membrane, enhancing convection of the pellicle relative to common thin film materials. This superior heat dissipation of porous CNT films has already been studied, demonstrating improved convection because of air flowing across the gaps in the film which allows CNTs at different locations to exchange heat with the surroundings 19,20 . Individual CNTs are known to be thermally stable up to around 2800 o C in vacuum or inert atmosphere 21 .…”

Section: Thermal Stabilitymentioning

confidence: 97%

CNT EUV pellicle: moving towards a full-size solution

Timmermans

Pollentier

Lee

et al. 2017

Photomask Technology

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Development of a pellicle membrane to protect the reticle from particles for EUV source powers beyond 250 W is a subject of intensive research and is in great demand to support high volume manufacturing with EUV lithography. Identifying a membrane with high EUV transmission, mechanical integrity, thermal stability and chemical resistance within the scanner environment is extremely challenging; yet these properties are required to realize next-generation EUV pellicle solutions. This paper proposes free-standing carbon nanotube (CNT) film as an alternative next generation core pellicle material. Most of the desired pellicle characteristics can be achieved by tuning the properties of freestanding CNT films. We demonstrate that free-standing CNT films possess very high EUV transmission (up to 99%) and good transmission uniformity (0.4% half range), mechanical stability (maximum deflection ~0.08 mm at 2 Pa), thermal stability (no change under greater than 500 W equivalent EUV exposure in vacuum without hydrogen radicals) and scalability to a full pellicle size. Other important CNT membrane properties are presented and are favourable for the pellicle application: low EUV scattering, low EUV reflectivity and high transmission under DUV. The ability of the CNT film to stop particles is analysed. The only known failure of the CNT membrane is instability to hydrogen radical/ion environment within the current reticle chamber of the scanner. If changing that environment to limit hydrogen radicals near the pellicle surface is not an option, there is a need to coat the CNT structures for protection. The challenges and considerations for coating the free-standing CNT membranes are discussed.

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“…Heat dissipation has become an important challenge for rapid development of modern electronic devices due to energy consumption and utilizing performance [1,2,3,4,5]. New materials including carbon nanotubes [6,7], graphene quilts [8,9,10] and nanocomposites [11,12] with high thermal conductivity have been widely investigated. Unfortunately, the fabrication processing of these materials is complicated and expensive, thus limiting their practical application in electronics [13].…”

Section: Introductionmentioning

confidence: 99%

“…Surface structures have been considered as an effective way to enhance heat transfer properties under natural convection [7,14]. Lee et al [15] used a conventional mechanical machine to fabricate micro-channels with hydraulic diameters ranging from 318 to 903 μm on copper, and indicated that the heat transfer coefficient was inverse proportional to channel size at a given flow rate.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Zhang

2018

Polymers

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Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics.

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Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices

Cited by 37 publications

References 54 publications

Promoting Energy Efficiency via a Self‐Adaptive Evaporative Cooling Hydrogel

Promoting Energy Efficiency via a Self‐Adaptive Evaporative Cooling Hydrogel

CNT EUV pellicle: moving towards a full-size solution

Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

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