2018
DOI: 10.3390/app8112197
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Enhancement of Exit Flow Uniformity by Modifying the Shape of a Gas Torch to Obtain a Uniform Temperature Distribution on a Steel Plate during Preheating

Abstract: The objective of this study is to improve the exit flow uniformity of a gas torch with multiple exit holes for effective heating of a steel plate. The torch was simulated, and combustion experiments were performed for validation. Based on a basic model, three different revised models were designed and analyzed with the software ANSYS FLUENT 18.2. The flow uniformity (γ) of the velocity distribution at the multiple exit holes was investigated with the pressure drop ranging from 100 to 500 Pa. The basic model ha… Show more

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Cited by 9 publications
(4 citation statements)
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“…𝑢 𝑖 is the velocity at the i_th position, and 𝑢 𝑎 ̅̅̅ is the mean of the velocities. The value of γ 𝑎 is between 0 and 1, γ 𝑎 = 1 shows an excellent uniform distribution [33].…”
Section: Physical Properties Of the Cfd Modelmentioning
confidence: 99%
“…𝑢 𝑖 is the velocity at the i_th position, and 𝑢 𝑎 ̅̅̅ is the mean of the velocities. The value of γ 𝑎 is between 0 and 1, γ 𝑎 = 1 shows an excellent uniform distribution [33].…”
Section: Physical Properties Of the Cfd Modelmentioning
confidence: 99%
“…( 1) are supposed to be evaluated at the centres of the rectangles of the equal areas A i that cross-section is divided into. In other cases, the L1 norm based metric of flow uniformity [7] is used:…”
Section: Introductionmentioning
confidence: 99%
“…( 1)- (5). For the purpose of testing against the requirements [6] and [7] additional parameters were calculated: A <85% , A >115% and A >140% as per cent of total area of the cross-section that exhibit velocities < 85%, > 115%•and > 140% of v ave respectively. A guide vanes configuration which enabled the best homogeneity parameters, as lower as possible pressure drop through the ESP and overall weight of design, was selected for implementation.…”
Section: Introductionmentioning
confidence: 99%
“…In these cases, a numerical simulation-based approach for the PCBA reflow soldering process has become an important and essential method due to its inherent advantages such as relative short time, low cost and no consumption of the physical products. There are several ways to simulate the reflow soldering process, including the finite element method (FEM) [4], finite volume method (FVM) [5,6], fluid-structure interface (FSI) [7], lattice Boltzmann's method (LBM) [8], discrete phase method (DPM) [9] and molecular dynamic (MD) [10]. Whall et al [11] used ANSYS finite element analysis software to conduct temperature field simulation of 2-D PCBA components and obtained simulated temperature data.…”
Section: Introductionmentioning
confidence: 99%