Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

“…Common metal-to-metal soldering combinations include Cu–Cu, Au–Au, Au–In, Au–Sn, Pb–Sn, and Cu–Sn [ [11] , [12] , [13] , [14] , [15] , [16] ]. However, Cu–Cu soldering requires extremely low surface roughness, ultra-high pressure, and harsh vacuum environments [ 17 , 18 ]. Although Au and In are expensive and rare metals, Au–In intermetallic compounds can be formed at lower temperatures (160 °C) and can be used for low-temperature solder bonding [ [19] , [20] , [21] ].…”