2016
DOI: 10.1166/nnl.2016.2195
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Enhanced Thermoelectric Properties of <I>p</I>-Type Bi<SUB>0.5</SUB>Sb<SUB>1.5</SUB>Te<SUB>3</SUB> Thin Films by Post-Annealing Process

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Cited by 2 publications
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“…After the deposition of the p-BT/BST SL films, all of the samples were annealed at 200 °C for 30 min under the Ar atmosphere. 19 For comparison, 200 nm-thick p-BST thin films were also prepared using the same RF sputtering and annealing conditions.…”
Section: Methodsmentioning
confidence: 99%
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“…After the deposition of the p-BT/BST SL films, all of the samples were annealed at 200 °C for 30 min under the Ar atmosphere. 19 For comparison, 200 nm-thick p-BST thin films were also prepared using the same RF sputtering and annealing conditions.…”
Section: Methodsmentioning
confidence: 99%
“…The total thickness of the samples was ∼200 nm, as verified by the cross-sectional field emission scanning electron microscopy image (SIGMA/Carl Zeiss, Germany). After the deposition of the p-BT/BST SL films, all of the samples were annealed at 200 °C for 30 min under the Ar atmosphere . For comparison, 200 nm-thick p-BST thin films were also prepared using the same RF sputtering and annealing conditions.…”
Section: Experimental Detailsmentioning
confidence: 99%
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“…High performance of thermoelectric (TE) materials requires high electrical conductivity, low thermal conductivity, and a high Seebeck coefficient and power factor. This leads to a large figure of merit, ZT = S 2 σ T /κ, where σ is the electrical conductivity, S is the Seebeck coefficient, T is the absolute temperature, and κ is the thermal conductivity. Recently, Bi 2 Te 3 and Sb 2 Te 3 and the alloys (Bi–Sb–Te) of these materials have played a significant role in TE technology due to their promising TE properties for operations around 300 K or up to 400 K. For instance, the ternary bismuth antimony telluride (Bi 0.5 Sb 1.5 Te 3 , BST) alloy is the most commercially available p-type TE material for use in electronic refrigeration and energy generators with Sb 2 Te 3 alloy materials . Recently, Kim et al reported a Bi 0.5 Sb 1.5 Te 3 polycrystalline bulk material with dense dislocation arrays in grain boundaries.…”
Section: Introductionmentioning
confidence: 99%