Enhanced thermoelectric properties of Cu1.8S by Ti-doping induced secondary phase

Liang, Dou-Dou; Zhang, Bo‐Ping; Zou, Liang

doi:10.1016/j.jallcom.2017.09.305

Cited by 27 publications

(8 citation statements)

References 53 publications

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“…With increasing Ni-doping, the ZT is enhanced obviously, and the maximum ZT of all samples is realized at 773 K. Owing to the low thermal conductivity, the highest ZT value reaches 0.9 for the Cu 1.88 Ni 0.02 S sample at 773 K, which is 40.6% higher than that of pristine samples. A comparison of the average ZT of our work with other Cu-S-based compounds is displayed in Figure b. ,,,− The average ZT reaches about 0.39 from 323 to 773 K for Cu 1.88 Ni 0.02 S, which demonstrates that Cu 1.9 S is a pleasurable candidate for thermoelectric application, and this may provide guidance to improve the thermoelectric performances of copper sulfide compounds in the future.…”

Section: Results and Discussionmentioning

confidence: 69%

Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity

Shen

Zheng

Liu

et al. 2020

ACS Appl. Mater. Interfaces

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At present, copper sulfide materials have been predicted as promising thermoelectric materials due to their inexpensiveness and nontoxicity property. Most researches on copper sulfide are focused on Cu2S and Cu1.8S because they are more easily synthesized into a single phase; however, the improper electrical conductivity greatly hindered their thermoelectric properties. In this work, a series of high-performance Cu1.9–x Ni x S (x = 0, 0.01, 0.015, and 0.02) bulk samples were fabricated by accurately manipulating the ratio of Cu/S with appropriate Ni-doping. The thermoelectric properties of Ni-doped Cu1.9S were explored in detail for the first time. It can be found that carrier thermal conductivity and lattice thermal conductivity of Cu1.9–x Ni x S were effectively reduced via Ni-doping, simultaneously, without the great influence on the power factor. Here, the carrier thermal conductivity (κe) was reduced due to the extreme reduction of Hall carrier concentration. In addition, amounts of nanopores introduced by Ni-doping and complex crystal structure from the phase transition of the second phase strengthen the phonon scattering and reduce lattice thermal conductivity (κl) remarkably. As a consequence, the lowest carrier thermal conductivity and lattice thermal conductivity reach 0.006 and 1.08 W m–1 K–1 for Cu1.88Ni0.02S at 773 K, and the average ZT is about 0.39 from 323 to 773 K (the ZTmax is about 0.9 at 773 K). This work demonstrates that low-cost and easily fabricated Ni-doped Cu1.9S is a pleasurable candidate for thermoelectric application despite it usually being treated as an ion conductor.

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Section: Results and Discussionmentioning

confidence: 69%

Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity

Shen

Zheng

Liu

et al. 2020

ACS Appl. Mater. Interfaces

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“…For example, Liu et al [ 29 ] prepared Cu 2 S films by vacuum-assisted filtration. The maximum PF of composite films was 56.15 μW·m −1 ·K −2 when Cu 2 S content was 10 wt% at 393 K. Liang et al [ 34 ] prepared Cu 2 S by Ti4+ doping. The peak ZT value of 0.54 at 673 K. As a fast, very low-cost, graphic, and large-area method for screen printing to prepare thin films, there are few reports on Cu 2 S flexible thermoelectric films, although it has been widely used to prepare other thermoelectric films [ 35 , 36 , 37 , 38 , 39 ].…”

Section: Introductionmentioning

confidence: 99%

Preparation and Characterization of Screen-Printed Cu2S/PEDOT:PSS Hybrid Films for Flexible Thermoelectric Power Generator

Zhao

Guo

et al. 2022

Nanomaterials

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In recent years, flexible thermoelectric generators(f-TEG), which can generate electricity by environmental temperature difference and have low cost, have been widely concerned in self-powered energy devices for underground pipe network monitoring. This paper studied the Cu2S films by screen-printing. The effects of different proportions of p-type Cu2S/poly 3,4-ethylene dioxythiophene-polystyrene sulfonate (PEDOT:PSS) mixture on the thermoelectric properties of films were studied. The interfacial effect of the two materials, forming a superconducting layer on the surface of Cu2S, leads to the enhancement of film conductivity with the increase of PEDOT:PSS. In addition, the Seebeck coefficient decreases with the increase of PEDOT:PSS due to the excessive bandgap difference between the two materials. When the content ratio of Cu2S and PEDOT:PSS was 1:1.2, the prepared film had the optimal thermoelectric performance, with a maximum power factor (PF) of 20.60 μW·m−1·K−1. The conductivity reached 75% of the initial value after 1500 bending tests. In addition, a fully printed Te-free f-TEG with a fan-shaped structure by Cu2S and Ag2Se was constructed. When the temperature difference (ΔT) was 35 K, the output voltage of the f-TEG was 33.50 mV, and the maximum power was 163.20 nW. Thus, it is envisaged that large thermoelectric output can be obtained by building a multi-layer stacking f-TEG for continuous self-powered monitoring.

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“…Concerns have also been expressed about the reliability of laser-flash measurements of thermal conductivity in materials undergoing phase transitions, analogous to those in copper sulfides. 97 More modest enhancements in performance have been achieved through doping with titanium ((ZT) max = 0.54 at 673 K) 98 and with bismuth ((ZT) max = 0.61 at 673 K) 99 . In the former case, higher levels of titanium doping induce sulfur volatilization and the formation of Cu 4 TiS 4 and Cu 1.96 S as secondary phases, which may be responsible for the significant reduction in thermal conductivity observed.…”

Section: Binary Copper Sulfides and Their Derivativesmentioning

confidence: 99%

Recent developments in Earth-abundant copper-sulfide thermoelectric materials

Powell

2019

Journal of Applied Physics

114

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The ability of thermoelectric devices to convert waste heat into useful electrical power has stimulated a remarkable growth in research into thermoelectric materials. There is however, growing recognition that limited reserves of tellurium together with the reduction in performance that occurs at elevated temperatures, places constraints on the widespread implementation of thermoelectric technology based on the current generation of telluridebased devices. Metal sulfides have attracted considerable attention as potential tellurium-free

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Enhanced thermoelectric properties of Cu1.8S by Ti-doping induced secondary phase

Cited by 27 publications

References 53 publications

Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity

Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity

Preparation and Characterization of Screen-Printed Cu2S/PEDOT:PSS Hybrid Films for Flexible Thermoelectric Power Generator

Recent developments in Earth-abundant copper-sulfide thermoelectric materials

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Enhanced thermoelectric properties of Cu1.8S by Ti-doping induced secondary phase

Cited by 27 publications

References 53 publications

Boosting High Thermoelectric Performance of Ni-Doped Cu1.9S by Significantly Reducing Thermal Conductivity

Boosting High Thermoelectric Performance of Ni-Doped Cu1.9S by Significantly Reducing Thermal Conductivity

Preparation and Characterization of Screen-Printed Cu2S/PEDOT:PSS Hybrid Films for Flexible Thermoelectric Power Generator

Recent developments in Earth-abundant copper-sulfide thermoelectric materials

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Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity

Boosting High Thermoelectric Performance of Ni-Doped Cu_1.9S by Significantly Reducing Thermal Conductivity