2003
DOI: 10.1007/s11664-003-0206-z
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Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

Abstract: The effect of a thin RuO x layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuO x /TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450-600°C. The Ru/TiN/poly-Si/Si contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuO x /TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no formation of a t… Show more

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Cited by 5 publications
(3 citation statements)
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“…Because of its quasi-metallic conductivity and excellent thermal and chemical stability, titanium nitride (TiN) has already been used as a gate electrode for field effect transistors and memory devices in the semiconductor industry and as a capacitor electrode and copper diffusion barrier in interconnect technology. [17][18][19][20][21] Here, we show that TiN/n-Si heterocontacts exhibit excellent electronselective, hole-blocking characteristics, a very low r c , and a moderate J 0c . Because of its high conductivity, quasi-metallic TiN is able to act simultaneously as the metal electrode.…”
Section: Context and Scalementioning
confidence: 99%
“…Because of its quasi-metallic conductivity and excellent thermal and chemical stability, titanium nitride (TiN) has already been used as a gate electrode for field effect transistors and memory devices in the semiconductor industry and as a capacitor electrode and copper diffusion barrier in interconnect technology. [17][18][19][20][21] Here, we show that TiN/n-Si heterocontacts exhibit excellent electronselective, hole-blocking characteristics, a very low r c , and a moderate J 0c . Because of its high conductivity, quasi-metallic TiN is able to act simultaneously as the metal electrode.…”
Section: Context and Scalementioning
confidence: 99%
“…1(b). TiN is use as front contact of lower subcell with work function of 4.3eV because of its excellent chemical and thermal stability and quasi-metallic conductivity and as a copper diffusion barrier for interconnect technologies [35,36]. A highly doped Back Surface Field (BSF) p ++ -Si used to minimize carrier recombination losses on the rear surface.…”
Section: Methodsmentioning
confidence: 99%
“…Despite the progress already achieved for passivating contacts in enhancing carrier selectivity and device performance, their stability remains a critical issue to be addressed. Although a few CTL materials show reasonable stability (e.g., TiN), 59,219 most CTL materials are readily acknowledged to be susceptible to external stimuli. This is due on one hand to their intrinsic thermodynamic instability, 201,215 and on the other hand to the chemical reaction and elemental diffusion occurring at interfaces upon contact with other materials (such as c-Si, electrodes, etc.).…”
Section: Stabilitymentioning
confidence: 99%