2020
DOI: 10.1016/j.compscitech.2020.108304
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Enhanced thermal conductivity of epoxy composites by constructing aluminum nitride honeycomb reinforcements

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Cited by 97 publications
(40 citation statements)
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“…Nowadays, the intelligent electronic devices have been developed towards high power density and miniaturization direction, which arouses urgent requirement for the thermal management materials (TMMs) with excellent performance [1][2][3][4]. The advanced TMMs should have the characteristics of low density, high strength, and high thermal conductivity (TC) perpendicular to the inferior mechanical properties and high CTE in outplane direction of the highly oriented graphite blocks lead to the failure under harsh service environments [11].…”
Section: Introduction mentioning
confidence: 99%
“…Nowadays, the intelligent electronic devices have been developed towards high power density and miniaturization direction, which arouses urgent requirement for the thermal management materials (TMMs) with excellent performance [1][2][3][4]. The advanced TMMs should have the characteristics of low density, high strength, and high thermal conductivity (TC) perpendicular to the inferior mechanical properties and high CTE in outplane direction of the highly oriented graphite blocks lead to the failure under harsh service environments [11].…”
Section: Introduction mentioning
confidence: 99%
“…The increasing power density and decreasing size of electric devices have made their thermal management challenging [1][2][3]. To efficiently dissipate the heat of electronic components, advanced thermal management materials (TMMs) with excellent thermal conductivity (TC, ≥ 250 W/m/K) and low density should be developed.…”
Section: Introductionmentioning
confidence: 99%
“…Wei et al fabricated anisotropic EP/aluminum nitride honeycomb composites via a freeze-casting method. The obtained materials possessed in-plane and through-plane thermal conductivities of 9.48 and 4.45 W m −1 K −1 at a filler content of 47.26 vol.%, respectively [ 31 ]. Xu et al prepared 3D BN foam-filled EP composites by mixing, decomposition, and infiltration techniques, which exhibited a high thermal conductivity of 6.11 W m −1 K −1 at a filler content of 59.43 vol.% [ 32 ].…”
Section: Introductionmentioning
confidence: 99%