2019
DOI: 10.1002/er.5045
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Enhanced thermal conductivity of copper‐doped polyethylene glycol/urchin‐like porous titanium dioxide phase change materials for thermal energy storage

Abstract: Summary A composite phase change material (PCM) of copper‐doped polyethylene glycol (PEG) 2000 impregnated urchin‐like porous titanium dioxide (TiO2) microspheres (PEG/TiO2) was successfully synthesised. The urchin‐like porous TiO2 structures contain hollow cavities that can provide a high PEG loading capacity of up to 80 wt%. Copper nanoparticles were uniformly dispersed on the outer and inner surfaces of the 0.8PEG/TiO2 as additives to enhance the thermal conductivity of the composite PCM. The latent heat of… Show more

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Cited by 29 publications
(18 citation statements)
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References 54 publications
(91 reference statements)
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“…The method of adding fillers is a fast way to improve the thermal conductivity of polymers. Metal materials (such as copper powder [ 7 , 8 , 9 ], silver powder [ 10 , 11 ], metal sheet and wire [ 12 , 13 , 14 ]), carbon materials (such as carbon fiber (CF) [ 15 , 16 , 17 ], graphene material [ 18 , 19 ], graphite material [ 20 , 21 ], carbon nanotubes [ 22 , 23 ], carbon black [ 24 , 25 ]), inorganic fillers (such as aluminum nitride [ 26 , 27 ], boron nitride [ 28 , 29 , 30 ], silicon nitride [ 31 , 32 ], silicon carbide [ 33 ], alumina [ 34 , 35 ]) and other high thermal conductivity fillers are often used to improve the thermal conductivity of polymers. When the particulate filler content is small, it is difficult to significantly improve the thermal conductivity of the matrix.…”
Section: Introductionmentioning
confidence: 99%
“…The method of adding fillers is a fast way to improve the thermal conductivity of polymers. Metal materials (such as copper powder [ 7 , 8 , 9 ], silver powder [ 10 , 11 ], metal sheet and wire [ 12 , 13 , 14 ]), carbon materials (such as carbon fiber (CF) [ 15 , 16 , 17 ], graphene material [ 18 , 19 ], graphite material [ 20 , 21 ], carbon nanotubes [ 22 , 23 ], carbon black [ 24 , 25 ]), inorganic fillers (such as aluminum nitride [ 26 , 27 ], boron nitride [ 28 , 29 , 30 ], silicon nitride [ 31 , 32 ], silicon carbide [ 33 ], alumina [ 34 , 35 ]) and other high thermal conductivity fillers are often used to improve the thermal conductivity of polymers. When the particulate filler content is small, it is difficult to significantly improve the thermal conductivity of the matrix.…”
Section: Introductionmentioning
confidence: 99%
“…Hou et al developed a new composite PCM, the material is Cu/PEG/TiO2 composite material, the latent heat value is 133.8 kJ/kg, and the thermal conductivity is 0.58 W/(m·K). This conforms to the PCM with good thermal stability and reliability 97 . Methods for enhancing the charge‐release rate of the PCM also include methods such as adding metal foam and nanoparticles to the PCM 98 …”
Section: Pcms Used In Stcsmentioning
confidence: 66%
“…This conforms to the PCM with good thermal stability and reliability. 97 Methods for enhancing the charge-release rate of the PCM also include methods such as adding metal foam and nanoparticles to the PCM. 98 Zhang et al 99 added EG to paraffin to prepare composite PCM with higher thermal conductivity.…”
Section: Pcms Used In Stcsmentioning
confidence: 99%
“…Moreover, Silica (SiO 2 ) and titania (TiO 2 ) were also used as inorganic supporting material for synthesized of shape‐stabilized PCMs. Hou et al used urchin‐like porous TiO 2 as a carrier for preparation of polyethylene glycol (PEG)/TiO 2 composite PCMs via impregnation method and they dispersed copper particles on the composite for enhancing thermal conductivity 38 . In another work, mesoporous silica functionalized by dopamine was used as a supporter for obtaining PEG‐based shape stabilized PCM and thermal properties of composites were investigated 39 .…”
Section: Introductionmentioning
confidence: 99%