Enhanced thermal conductivity of alumina and carbon fibre filled composites by 3-D printing

Ji, Jiacheng; Chiang, Sumwai; Liu, Mengjing; Liang, Xin; Li, Jia; Gan, Lin; He, Yan‐Bing; Li, Baohua; Kang, Feiyu; Du, Hongda

doi:10.1016/j.tca.2020.178649

Cited by 39 publications

(19 citation statements)

References 40 publications

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“…That would facilitate the formation of thermal pathways of Cu particles and lead to a higher thermal conductivity of PLA composites. It should be noted that the enhancement of thermal conductivity of the 3D printed PLA composites is higher than previous studies, which utilized metal‐ or carbon‐based fillers in the 3D printed polymer composites 37–43 . For example, the printed Cu(50 wt%)/ABS composites showed only 41% improvement on thermal conductivity compared to that of bare ABS resin 28 .…”

Section: Resultsmentioning

confidence: 71%

“…It should be noted that the enhancement of thermal conductivity of the 3D printed PLA composites is higher than previous studies, which utilized metal-or carbon-based fillers in the 3D printed polymer composites. [37][38][39][40][41][42][43] For example, the printed Cu(50 wt%)/ABS composites showed only 41% improvement on thermal conductivity compared to that of bare ABS resin. 28 The enhancement on thermal conductivity of PMMA beads-Cu/PLA composites implies a segregation effect of Cu particles in the 3D printed structures.…”

Section: Characterizationmentioning

confidence: 99%

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3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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Poly(lactic acid) (PLA) composite filaments with different copper (Cu) contents as high as 40 and 20 wt% of poly(methyl methacrylate) (PMMA) beads have been fabricated by twin-screw extruder for 3D printing. A fuseddeposition modeling (FDM) 3D printing technology has been used to print the PLA composites containing hybrid fillers of Cu particles and PMMA beads. The morphology, mechanical, and thermal properties of the printed PLA composites were investigated. The tensile strength was slightly decreased, but storage modulus and thermal conductivity of PLA composites were significantly improved by adding Cu particles in the presence of PMMA beads. The PLA composites with hybrid fillers of 40 wt% of Cu particles and 20 wt% of PMMA beads resulted in thermal conductivity of 0.49 W m −1 K −1 which was three times higher than that of the bare PLA resin. The facilitation of the segregated network of high-thermally conductive Cu particles with the PMMA beads in PLA matrix provided thermally conductive pathways and resulted in a remarkable enhancement in thermal conductivity.

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Section: Resultsmentioning

confidence: 71%

Section: Characterizationmentioning

confidence: 99%

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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“…3D-printing silicone acrylate-based formulations (Polydimethylsiloxane, PDMS) with enhanced thermal conductivity due to the introduction of boron nitride (BN) as conductive filler were proposed and investigated by Pezzana et al [28]. A 3D-printed composite with alumina and oriented carbon nanofibers (CFs) with enhanced thermal conductivity compare to that of cast composites was discussed by Ji et al [29]. PLA-based nanocomposites filled with four different metal particles were prepared by 3D-printing and then characterized in order to investigate the influence of the additive microstructures, along with the printing parameter settings, on the thermal conductivity of the resulting structures.…”

Section: Polymermentioning

confidence: 99%

Experimental, Theoretical and Simulation Studies on the Thermal Behavior of PLA-Based Nanocomposites Reinforced with Different Carbonaceous Fillers

et al. 2021

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Many research efforts have been directed towards enhancing the thermal properties of polymers, since they are classically regarded as thermal insulators. To this end, the present study focuses on the thermal investigation of poly(lactic acid) (PLA) filled with two types of carbon nanotubes (trade names: TNIMH4 and N7000), two type of graphene nanoplatelets (trade names: TNIGNP and TNGNP), or their appropriate combination. A significant increase in the thermal conductivity by 254% with respect to that of unfilled polymer was achieved in the best case by using 9 wt% TNIGNP, resulting from its favorable arrangement and the lower thermal boundary resistance between the two phases, matrix and filler. To theoretically assist the design of such advanced nanocomposites, Design of Experiments (DoE) and Response Surface Method (RSM) were employed, respectively, to obtain information on the conditioning effect of each filler loading on the thermal conductivity and to find an analytical relationship between them. The numerical results were compared with the experimental data in order to confirm the reliability of the prediction. Finally, a simulation study was carried out with Comsol Multiphysics® for a comparative study between two heat sinks based on pure PLA, and to determine the best thermally performing nanocomposite with a view towards potential use in heat transfer applications.

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“…In Figure 15 c, all the fibers are arranged toward the outer plate. Comparing the final verification with the volume fraction of the fiber, the orientation of the fiber is a very important factor that affects temperature distribution [ 98 , 99 ].…”

Section: Modification Of Thermal Characteristics Of Epoxy Resin Composite Foam Insulation Materialsmentioning

confidence: 99%

Current Status of Research on the Modification of Thermal Properties of Epoxy Resin-Based Syntactic Foam Insulation Materials

Zhang

Dai

et al. 2021

Polymers

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As a lightweight and highly insulating composite material, epoxy resin syntactic foam is increasingly widely used for insulation filling in electrical equipment. To avoid core burning and cracking, which are prone to occur during the casting process, the epoxy resin-based syntactic foam insulation materials with high thermal conductivity and low coefficient of thermal expansion are required for composite insulation equipment. The review is divided into three sections concentrating on the two main aspects of modifying the thermal properties of syntactic foam. The mechanism and models, from the aspects of thermal conductivity and coefficient of thermal expansion, are presented in the first part. The second part aims to better understand the methods for modifying the thermal properties of syntactic foam by adding functional fillers, including the addition of thermally conductive particles, hollow glass microspheres, negative thermal expansion filler and fibers, etc. The third part concludes by describing the existing challenges in this research field and expanding the applicable areas of epoxy resin-based syntactic foam insulation materials, especially cross-arm composite insulation.

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Enhanced thermal conductivity of alumina and carbon fibre filled composites by 3-D printing

Cited by 39 publications

References 40 publications

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Experimental, Theoretical and Simulation Studies on the Thermal Behavior of PLA-Based Nanocomposites Reinforced with Different Carbonaceous Fillers

Current Status of Research on the Modification of Thermal Properties of Epoxy Resin-Based Syntactic Foam Insulation Materials

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