Enhanced thermal and mechanical properties of polyimide composites by mixing thermotropic liquid crystalline epoxy grafted aluminum nitride

He, Zihai; Dai, Wen; Yu, Jinhong; Pan, Leilei; Xiao, Xiane; Lu, Shaorong; Jiang, Nan

doi:10.1007/s10965-014-0595-0

Cited by 16 publications

(6 citation statements)

References 30 publications

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“…In recent years, researchers have used graphene [12], carbon nanotubes (CNT) [13], boron nitride (BN) [14], aluminum nitride (AlN) [15], etc. as thermally conductive fillers to prepare thermally conductive PI-based composite films by solution blending followed by blade coating.…”

Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients (λ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH2-GO) and reduced (NH2-rGO), then NH2-rGO/polyimide (NH2-rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH2-rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH2-rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ (λ∥) and through-plane λ (λ⊥) of 15 wt% NH2-rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ∥ (0.87 W/mK) and 3.5 times λ⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ∥ (5.50 W/mK) and λ⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH2-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

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Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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“…One simple and common method is to introduce high thermal conductive fillers into the matrix. A variety of fillers including silica (SiO 2 ) [7], alumina (Al 2 O 3 ) [8], silicon carbide (SiC) [9], silicon nitride (Si 3 N 4 ) [10,11], aluminum nitride (AlN) [12][13][14], boron nitride (BN) [15][16][17][18] and carbon materials [19][20][21][22] are chosen for the preparation of polymer composites with high thermal conductivity. Among carbon materials, graphene has attracted great attention owing to its fascinating physical properties such as quantum electronic transport, a tunable band gap, extremely high mobility, high elasticity and electromechanical modulation [23][24][25].…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Dai

Liu

et al. 2015

Composites Part A: Applied Science and Manufacturing

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138

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“…In general, the ICs are encapsulated by silica-filled epoxy composites, but the thermal conductivity of the composites is less than 1.0 W/m·K, which is far below the demand of ICs heat dissipation [ 10 ]. It can be enhanced by incorporation of inorganic fillers with a high thermal conductivity and electrical insulation, such as alumina (Al 2 O 3 ) [ 11 , 12 , 13 , 14 , 15 ], silicon carbide (SiC) [ 16 , 17 , 18 ], silicon nitride (Si 3 N 4 ) [ 19 , 20 , 21 ], aluminum nitride (AlN) [ 22 , 23 , 24 , 25 , 26 ], boron nitride (BN) [ 27 , 28 , 29 , 30 , 31 , 32 ], carbon nanotubes (CNTs) [ 33 , 34 , 35 ] and grapheme [ 36 , 37 , 38 ] or other ceramic fillers. Boron nitride with a hexagonal lattice structure (h-BN) is a platelet-shaped ceramic and is often called “white graphite”.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Thermomechanical Properties of Ketone Mesogenic Liquid Crystalline Epoxy Resin Composites with Functionalized Boron Nitride

Lin

Hsu

et al. 2020

Polymers

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In order to enhance the thermomechanical behaviors of epoxy molding compounds, the hexagonal boron nitride (h-BN) fillers were incorporated in a ketone mesogenic liquid crystalline epoxy (K–LCE) matrix to prepare a high-performance epoxy composites. The h-BN was modified by surface coupling agent 3-aminopropyltriethoxysilane (APTES). The grafting of silane molecules onto the surface of BN fillers improved the compatibility and homogeneous dispersion state of BN fillers in the K–LCE matrix with a strong interface interaction. The surface-modified BN fillers were characterized using Fourier transform infrared spectroscopy. The thermomechanical properties and morphologies of K–LCE/BN composites loading with different contents of modified BN fillers, ranging from 0.50 to 5.00 wt%, were investigated. These results show that modified BN fillers uniformly dispersed in K–LCE matrix, contributing to the enhancement in storage modulus, glass transition temperatures, impact strength and reduction in the coefficient of thermal expansion (CTE). The thermal stability and char yield of the K–LCE/BN composites were increased by increasing the amount of modified BN fillers and the thermal decomposition temperatures of composites were over 370 °C. The thermal conductivity of the K–LCE/BN composites was up to 0.6 W/m·K, for LC epoxy filled with 5.00-wt%-modified BN fillers. Furthermore, the K–LCE/BN composites have excellent thermal and mechanical properties compared to those of the DGEBA/BN composites.

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Enhanced thermal and mechanical properties of polyimide composites by mixing thermotropic liquid crystalline epoxy grafted aluminum nitride

Cited by 16 publications

References 30 publications

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Preparation and Thermomechanical Properties of Ketone Mesogenic Liquid Crystalline Epoxy Resin Composites with Functionalized Boron Nitride

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