Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2014
DOI: 10.1109/itherm.2014.6892422
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Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution

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“…These fluids are based on the patented Inorganic Aqueous Solution (IAS) developed at UCLA [11][12][13][14]. These fluids have demonstrated the ability to increase thermal performance and delay the onset of wick dryout.…”
Section: Figure 1: Heat Pipe Schematicmentioning
confidence: 99%
“…These fluids are based on the patented Inorganic Aqueous Solution (IAS) developed at UCLA [11][12][13][14]. These fluids have demonstrated the ability to increase thermal performance and delay the onset of wick dryout.…”
Section: Figure 1: Heat Pipe Schematicmentioning
confidence: 99%