Enhanced hotplug protection in BMS applications. Part II: Enhanced Solution Development

D'Angelo, Vittorio; Cannavacciuolo, Salvatore; Lecce, Sergio; Bendotti, Valerio; Pennisi, Orazio

doi:10.23919/eeta.2019.8804547

Cited by 1 publication

(4 citation statements)

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“…The centralized architecture [8] makes use of diodes to redirect the inrush current toward a single centralized ESD clamp. Fig.…”

Section: ) Centralized Architecturementioning

confidence: 99%

“…5a. displays the considered architecture: Relative to [8], diodes Da were added for a more realistic approach, in case some of the branches drop to negative values. Moreover, the Vc node is biased around the pack voltage, therefore, when going from one cell to the upper one, the voltage across Da increases and the voltage across Db decreases.…”

Section: ) Centralized Architecturementioning

confidence: 99%

“…The differential architecture in [7] [8] relies on differential Zener diodes to diverge the inrush current towards the ground. Similarly to the centralized architecture, the following model was proposed.…”

Section: ) Differential Architecturementioning

confidence: 99%

“…Besides, the capacitive effect of these diodes affects the IC's impedance in different manners depending on the HP protection architecture. Two main architectures are distinguished: a centralized architecture [8] and a differential one [7]. Therefore, having an on-hand analytical model for predicting the maximum noise coupling frequencies during DPI with the inclusion of the HP protection can be crucial in the early design steps.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

A Comparative Study of DPI levels on BMS IC With an On-Hand Analytical Model to Predict Resonances

Guendouz

Abouda²,

Boyer

et al. 2022

2022 International Symposium on Electromagnetic Compatibility – EMC Europe

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When it comes to the electromagnetic interference (EMI) immunity of a Battery Management System Integrated Circuit (BMS IC), Printed Circuit Board (PCB) traces, external components and BMS impedance have a major impact. In a number of cases, electromagnetic compatibility (EMC) issues are reported at the last testing phase which can lead to design changes thus increasing cost and time to market. In this context, this work gives an insight on what some design choices on the external components, PCB traces and hot-plug (HP) protection architecture can lead to in terms of the noise coupled to the BMS IC. Moreover, an analytical model based on ladder network theory is used to predict the main noise coupling frequencies under some low-cost design choices. This model is then used in the comparison of two HP protection architectures in terms of the noise coupled onto the BMS IC.

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“…The centralized architecture [8] makes use of diodes to redirect the inrush current toward a single centralized ESD clamp. Fig.…”

Section: ) Centralized Architecturementioning

confidence: 99%

Section: ) Centralized Architecturementioning

confidence: 99%