2018
DOI: 10.1002/solr.201800279
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Enhanced Hetero‐Junction Quality and Performance of Kesterite Solar Cells by Aluminum Hydroxide Nanolayers and Efficiency Limitation Revealed by Atomic‐resolution Scanning Transmission Electron Microscopy

Abstract: A strategy for interface engineering of hetero‐junctions in kesterite solar cells by using Al(OH)3 is demonstrated. The hydroxide nanolayers are prepared via a facile and fast wet chemical route, based on an aqueous solution of aluminum chlorides and thioacetamide. Considerable enhancement of open circuit voltage (Voc) (30–60 mV) and fill factor (FF) (10–20%) after this chemical treatment are observed, achieving a champion conversion efficiency of 9.1% and a champion FF of 70% (among the best FF in kesterite s… Show more

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Cited by 7 publications
(9 citation statements)
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“…To date, metal oxide (e.g. Al 2 O 3 , TiO 2 and Al(OH) 3 ) as a passivation layer has been introduced and studied in the case of kesterite [41,84,85]. Among them, Al 2 O 3 has been found to passivate the interface region dramatically, especially through the ALD process [41,42,82,83].…”
Section: Passivation Layer For Interfacial Defectsmentioning
confidence: 99%
“…To date, metal oxide (e.g. Al 2 O 3 , TiO 2 and Al(OH) 3 ) as a passivation layer has been introduced and studied in the case of kesterite [41,84,85]. Among them, Al 2 O 3 has been found to passivate the interface region dramatically, especially through the ALD process [41,42,82,83].…”
Section: Passivation Layer For Interfacial Defectsmentioning
confidence: 99%
“…In this case, the surface passivation of the absorber is of significant interest, as the interface between CZTS and CdS presents several issues due to the valence band offset and secondary phases which induces interface recombination. Usually, an etching treatment 31,32 or an oxide interlayer 33,34 is required for a passivation of interface defects. Figure 4 shows the J-V curves of the best device for each condition under AM1.5 illumination condition, and the average values are showed in the Table 2.…”
Section: Device Characterizationmentioning
confidence: 99%
“…To mention some: i. At the front interface: non-optimum band alignment with the CdS buffer layer, [11][12][13] Fermi level pinning due to CuZn antisite point defects, 14 incomplete CdS coverage, 15,16 high density of interface defects, 17,18 and ZnSe secondary phase formation. 19 ii.…”
Section: Introductionmentioning
confidence: 99%
“…19,27 Front interface recombination can also be reduced through surface passivation treatments 10,36 or the use of passivating nanolayers. 15,18,37,38 Regarding the back interface, the use of a thin ZnO layer on the Mo back contact has been demonstrated to reduce chemical instability 33 and the thickness of the MoSe2 layer can be controlled through multilayer Mo configurations and the use of selenization barriers. 34 Finally, in the bulk of the absorber, partial substitution of Cu by Ag or of Zn by Cd has been proposed to reduce Cu-Zn disordering 14 and Na-doping is commonly regarded as a means of grain boundary passivation.…”
Section: Introductionmentioning
confidence: 99%