Enhanced gas barrier and thermal properties of polyimide/montmorillonite nanocomposites as a result of “dual‐plane” structure effect

Liu, Yi Wu; Liu, Jun Jie; Ding, Qian; Tan, Jing; Chen, Jun Yi; She, Zhi Hong; Tang, Ao; Zeng, Ke

doi:10.1002/pc.24713

Cited by 5 publications

(3 citation statements)

References 32 publications

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“…They will lead to worse water/oxygen permeability, even though the water/oxygen permeability is always a pain point of CPI. The usual methods to solve this problem is coating barriers like SiN x O y [74] and Al 2 O 3 [75] or using composite fillers like graphene [75], montmorillonite [76], and other nanosheet fillers. Nanocomposite filler method is more practical in industrial production and can reduce the thermal expansion of CPI while keeping its transparency and thermal properties, so it is a more promising way in the future.…”

Section: Coefficient Of Linear Thermal Expansion (Cte)mentioning

confidence: 99%

Design, Fabrication, and Application of Colorless Polyimide Film for Transparent and Flexible Electronics

Chen¹,

Hui²,

Yu³

et al. 2021

Polyimide for Electronic and Electrical Engineering Applications

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Driven by the emerging development of transparent and flexible electronics, colorless polyimide (CPI) has been attracting much attention in recent years. As a key component for next generation electronics, CPI film will be well focused both on research and commercialization. In this chapter, we would like to provide a review and outlook to the field for the reference of scientists, engineers, and entrepreneurs. Topics being addressed are formulation/design, synthesis of the resin, fabrication, and characterization of the CPI films, as well as trends of the film application for the next generation of electronics. Attention will also be given to the current stage of manufacturing of CPI monomers and resin, industrial production of CPI films, etc.

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Section: Coefficient Of Linear Thermal Expansion (Cte)mentioning

confidence: 99%

Design, Fabrication, and Application of Colorless Polyimide Film for Transparent and Flexible Electronics

Chen¹,

Hui²,

Yu³

et al. 2021

Polyimide for Electronic and Electrical Engineering Applications

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“…Liu et al investigated the gas barrier and thermal properties of polyimide/graphene and polyimide/clay nanocomposites. They reported decreased water vapor transmission rates and improvement in the temperature of decomposition at 5% weight loss, concluding that addition of these nanofillers improved the thermal stability of the polyimide [ 16 , 17 ]. Wang et al observed an improvement in the mechanical, thermal, and hydrophobic properties of amino-functionalized graphene oxide/polyimide composite films.…”

Section: Introductionmentioning

confidence: 99%

Thermal Decomposition and Stability of Hybrid Graphene–Clay/Polyimide Nanocomposites

Akinyi

Iroh

2023

Polymers

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Polyimide matrix nanocomposites have gained more attention in recent years due to their high thermal stability, good interfacial bonding, light weight, and good wear resistance and corrosion, factors that make them find great applications in the field of aerospace and advanced equipment. Many advancements have been made in improving the thermal, mechanical, and wear properties of polyimide nanocomposites. The use of nanofillers such as carbon nanotubes, graphene, graphene oxide, clay, and alumina has been studied. Some challenges with nanofillers are dispersion in the polymer matrix and interfacial adhesion; this has led to surface modification of the fillers. In this study, the interaction between clay and graphene to enhance the thermal and thermal-oxidative stability of a nanocomposite was studied. A polyimide/graphene nanocomposite containing ~12.48 vol.% graphene was used as the base nanocomposite, into which varying amounts of clay were added (0.45–9 vol.% clay). Thermogravimetric studies of the nitrogen and air atmospheres showed an improvement in thermal decomposition temperature by up to 50 °C. The presence of both fillers leads to increased restriction in the mobility of polymer chains, and thus assists in char formation. It was observed that the presence of clay led to higher decomposition temperatures of the char formed in air atmosphere (up to 80 °C higher). This led to the conclusion that clay interacts with graphene in a synergistic manner, hence improving the overall stability of the polyimide/graphene/clay nanocomposites.

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“…While such strict performance requirements cannot be achieved by traditional high-barrier polymeric materials, the excellent heat resistance of PI makes it a promising substrate candidate [ 10 , 11 ]. However, the application of traditional PI as an OLED substrate is limited by its low barrier properties [ 12 , 13 ]. Fortunately, it is possible to synthesise PI with high barrier properties thanks to its excellent structural designability [ 14 , 15 ]…”

Section: Introductionmentioning

confidence: 99%

Impact of Backbone Amide Substitution at the Meta- and Para-Positions on the Gas Barrier Properties of Polyimide

et al. 2021

Self Cite

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This study designed and synthesised a meta-amide-substituted dianiline monomer (m-DABA) as a stereoisomer of DABA, a previously investigated para-amide-substituted dianiline monomer. This new monomer was polymerised with pyromellitic dianhydride (PMDA) to prepare a polyimide film (m-DABPI) in a process similar to that employed in a previous study. The relationship between the substitution positions on the monomer and the gas barrier properties of the polyimide film was investigated via molecular simulation, wide-angle X-ray diffraction (WXRD), and positron annihilation lifetime spectroscopy (PALS) to gain deeper insights into the gas barrier mechanism. The results showed that compared with the para-substituted DABPI, the m-DABPI exhibited better gas barrier properties, with a water vapour transmission rate (WVTR) and an oxygen transmission rate (OTR) as low as 2.8 g·m−2·d−1 and 3.3 cm3·m−2·d−1, respectively. This was because the meta-linked polyimide molecular chains were more tightly packed, leading to a smaller free volume and lower molecular chain mobility. These properties are not conducive to the permeation of small molecules into the film; thus, the gas barrier properties were improved. The findings have significant implications for the structural design of high-barrier materials and could promote the development of flexible display technology.

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Enhanced gas barrier and thermal properties of polyimide/montmorillonite nanocomposites as a result of “dual‐plane” structure effect

Cited by 5 publications

References 32 publications

Design, Fabrication, and Application of Colorless Polyimide Film for Transparent and Flexible Electronics

Design, Fabrication, and Application of Colorless Polyimide Film for Transparent and Flexible Electronics

Thermal Decomposition and Stability of Hybrid Graphene–Clay/Polyimide Nanocomposites

Impact of Backbone Amide Substitution at the Meta- and Para-Positions on the Gas Barrier Properties of Polyimide

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