Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer

Sakurai, Shintaro; Uda, Takuma; Kawasaki, Hideya

doi:10.1007/s10854-019-01571-y

Cited by 4 publications

(3 citation statements)

References 55 publications

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“…The resultant solution was stirred at 500 rpm for 1 h. Finally, residual methanol in the mixture was removed under vacuum for 2 h at 55 °C, and then under vacuum for 24 h at room temperature (approximately 23 °C). For comparison, we also prepared a CuF-AmIP complex (Cu:AmIP = 1:2 in molar ratio) as described previously …”

Section: Methodsmentioning

confidence: 99%

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Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures

Tomotoshi

Oogami

Kawasaki

2021

ACS Appl. Mater. Interfaces

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Recently, Ni and Ni-Cu nanoparticle-based inks have gained considerable research interest because of their high corrosion resistance as conductors in electronic devices. However, reported inks based on Cu-Ni nanoparticles need to be sintered at high temperatures above 300 °C to obtain electrodes with high conductivity on the order of 10–5 Ω·cm. This study proposes a new conductive Cu-Ni-based hybrid ink that could be sintered at only 150–180 °C for producing Cu-Ni electrodes with low electrical resistance, high oxidation resistance, and flexibility. The hybrid ink contains Cu flakes and a complex of nickel formate and 1-amino-2-propanol (NiF-AmIP complex). At 150–180 °C, the Cu flakes catalyze the self-reduction of the NiF-AmIP complex, and Cu-Ni electrodes with high conductivity (on the order of 10–5 Ω·cm) are formed on flexible polymer substrates at temperatures exceeding 150 °C. Analysis indicates that metallic Ni was decorated on the Cu flakes (especially on the edge) to improve the electrode’s conductivity, oxidation resistance, and flexibility by forming bridging interconnections between the Cu flakes. The Cu-Ni electrodes demonstrated high stability against oxidation up to approximately 400 °C in air, as well as at 80 °C and 80% RH after 7 days. In addition to the excellent oxidation stability, the Cu-Ni electrode showed high durability under mechanical bending stress. Such sintered Cu-Ni electrodes obtained from hybrid inks have great potentials in printed/flexible devices due to their oxidation resistance and cost-effectiveness.

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Section: Methodsmentioning

confidence: 99%

“…For comparison, we also prepared a CuF-AmIP complex (Cu:AmIP = 1:2 in molar ratio) as described previously. 49 Preparation of Cu-Ni Hybrid Inks. Detailed compositions of the Cu-Ni hybrid inks are listed in Table S2.…”

Section: Methodsmentioning

confidence: 99%

Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures

Tomotoshi

Oogami

Kawasaki

2021

ACS Appl. Mater. Interfaces

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“…Sakurai et al investigated the effect of various silane coupling agents in mixed pastes, including the CuF–AmIP complex and Cu flakes, on the flexibility and environmental durability of Cu electrodes on cellulose papers [ 158 ]. They utilized four different silane coupling agents: APS, aminoethyl-aminopropyltrimethoxysilane (AEAPTMS), 3-glycidoxypropyltrimethoxysilane (GPTMS), and mercaptopropyltrimethoxysilane (MPTMS).…”

Section: Adhesion Enhancement Of Sintered Cu Films On a Flexible Smentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films

Zhang

Chen

et al. 2019

Adv Materials Inter

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Highly compact and conductive Cu films are successfully fabricated by introducing mechanically robust and highly conductive metal nanowires (NWs) as fillers and optimizing amine‐based ligands in Cu complex inks. The metal NWs (AgNWs and CuNWs) dispersed in the complex inks provide networks of nucleation sites for the in situ formed Cu particles and thereby control the decomposition of Cu complex inks at low temperatures to realize Cu films with high uniformity and integrality. The high affinity between metal NWs and the in situ formed Cu element enables the growth of Cu particles along the metal NWs to create a compact structure. Besides, the amine‐based ligands such as 2‐amino‐2‐methyl‐1‐propanol (AMP), 2‐ethylhexylamine (Ethy), and hexylamine (Hexy) are varied to adjust the size of Cu particles and further improve the microstructure and conductivity of the sintered Cu films. The Cu‐Ethy complex/metal NW inks sintered at 140 °C exhibit the lowest resistivity of 14.9 µΩ cm, which is about one‐third that fabricated from the pure Cu‐AMP complex inks. The flexible light‐emitting diode circuits and V‐shaped dipole antennas prepared from the Cu complex/metal NW inks have excellent performance due to their outstanding conductivity and flexibility, showing great potential in the fabrication of cost‐effective, flexible printed electronic devices.

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Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer

Cited by 4 publications

References 55 publications

Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures

Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films

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