Enhanced finite element modelling of Cu electromigration using ANSYS and matlab

Li, Wei; Tan, Cher Ming

doi:10.1016/j.microrel.2007.07.058

Cited by 5 publications

(1 citation statement)

References 9 publications

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“…Over the last four decades, there has been a real need for special purpose structural materials, which can withstand huge load for a long duration at a very high temperature. Concentration of stress at the interface becomes more severe as the free surface's approaches [1][2][3]. Essential problems in solid-state bonding are strength of the bond at interface and thermal stress concentration [4 -5].…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Dissimilar Materials Diffusion Bonding Using Finite Element Method

Kumar

Ravisankar²,

Sheriff

et al. 2019

MSF

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Finite element method (FEM) is employed to study an effect of diffusion bonding strength between aluminium and its copper material and optimized parameters. The diffusion bonding soundness was estimated at different processing parameters such as temperature, pressure and time. The coefficients of linear thermal expansion (CTE) of the metals induce thermal stress at the bonded area. This phenomenon motivated the study of the stress distribution along with maximum and minimum stress values, while bonding of two dissimilar metals at particular bonding process parameters. The incompatible thermal stress at the bonded area plays a vital role in better bond soundness. Thus, it is required to estimate the bonding interface in dissimilar joints. This study was performed using the FEM and the analysis was carried out using the commercial software package Ansys V12.0

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Section: Introductionmentioning

confidence: 99%