Enhanced Cu-Teflon adhesion by presputtering prior to the Cu deposition

Chang, C. C.; Baglin, J. E. E.; Schrott, A. G.; Lin, Kun-Yi

doi:10.1063/1.98637

Cited by 116 publications

(45 citation statements)

References 19 publications

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“…Previously, the fluoride ion peak at a binding energy of 684 eV in the XPS spectrum was detected when evaporated Cu was thermally annealed for 30 min at 150 C on Teflon AF1600 [29] and when octofluorocyclobutane was plasma polymerized on a Cu substrate. [30] In contrast to evaporated Cu, which can be peeled easily and totally removed from untreated PFA, [9] , FEP [A. R. Guntuka and A. Entenberg, unpublished research] and PTFE, [3,7] the fluoropolymers modified to contain fluoride ions at the interface showed enhanced adhesion to thermally evaporated Cu as reported in Table 4. In addition to these chemical effects, changes in surface roughness during argon etching will also contribute to the better adhesion.…”

Section: Discussionmentioning

confidence: 82%

“…[1,2] However, the low surface energy property of fluoropolymers results in poor practical adhesion of evaporated Cu to PTFE, [3][4][5][6][7] FEP [5,6,8] and PFA. [5,6,8,9] Quantitative measurements of the adhesion strengths show stronger adhesion of evaporated copper to FEP and PFA than to PTFE, which is attributed to the larger group electronegativities of CF 3 in FEP and C 3 F 7 O in PFA than to F in PTFE.…”

Section: Introductionmentioning

confidence: 99%

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Fluoride ions at the Cu–fluoropolymer interface

Naujokas

Abreu

Takacs

et al. 2013

Surface & Interface Analysis

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Nanometer thick films of sputtered and evaporated Cu were deposited on the surfaces of the fluoropolymers poly(tetrafluoroethylene) (PTFE), poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) and poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) and studied by both angle-resolved XPS at takeoff angles of 10 , 45 and 80 and in situ argon ion etching. Higher yields of the fluoride ion to fluoropolymer ratio were detected for sputtered than evaporated Cu. PFA and FEP show enhanced interaction with sputtered Cu to produce fluoride ions relative to the more polycrystalline PTFE. At intermediate depths (takeoff angle of 45 ), PFA and FEP exhibit the strongest fluoride F 1s signals compared with the fluoropolymer peaks. The amount of fluoride ion detected reaches a maximum after brief Ar ion etching and then decreases with prolonged etching. Compared with untreated fluoropolymers, improved adhesion of evaporated Cu was observed on the fluoropolymer surfaces that were argon ion etched to expose fluoride ions.

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Section: Discussionmentioning

confidence: 82%

Section: Introductionmentioning

confidence: 99%

Fluoride ions at the Cu–fluoropolymer interface

Naujokas

Abreu

Takacs

et al. 2013

Surface & Interface Analysis

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“…In previous reports, the rise in substrate temperature during low-energy X-ray irradiation was reported to be in the tens of degrees. The maximum increase in the substrate temperature during high-energy X-ray irradiation as described in this paper exceeded 200°C [6]. It is not clear whether this was caused by a difference in the energy range, but when the rise in the substrate temperature exceeds 200 °C, different characteristics from those seen in previous research may appear.…”

Section: Large-surface-area Synchrotron Radiationmentioning

confidence: 73%

“…A conventional PTFE surface is inactive and has the problem of not providing sufficient adhesive force for a thin film. Thin film formation by Cu sputtering on PTFE has been reported [6]. In our investigation, activation of the PTFE surface was possible due to plasma surface processing of the PTFE substrate surface as preparation for Cu thin film formation, and the peel strength of the Cu thin film improved dramatically.…”

Section: Metal Film Formation On a Ptfe Substratementioning

confidence: 88%

Microfabrication of polytetrafluoroethylene using SR direct etching

Yamamoto

Ukita

Mochiji

et al. 2011

Electrical Engineering Japan

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SUMMARYPolytetrafluoroethylene (PTFE) is a very attractive material for various fields because of its chemical resistance, insulation properties, and hydrophobic properties. However, it is difficult to fabricate PTFE microstructures with conventional techniques such as semiconductor processes or micromachining. We have succeeded in the fabrication of high-aspect-ratio microfluidics parts from PTFE by direct in-vacuum photo-etching utilizing synchrotron radiation (SR) at energy levels from 2 to 12 keV. This paper presents an analysis of the mechanisms of the PTFE microfabrication process and describes newly discovered processing characteristics of PTFE.

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“…Chang et al [1][2][3] utilized a presputtering technique to improve the adhesion of PTFE films to a deposed copper layer. The adhesion enhancement was attributed to morphology changes of the PTFE film surface.…”

Section: Introductionmentioning

confidence: 99%

Effects of Polymer Architecture and Composition on the Adhesion of Poly(tetrafluoroethylene)

Liu

Luo

et al. 2006

ChemPhysChem

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Poly(glycidyl methacrylate), PGMA, chains in linear and arborescent structures were incorporated onto surfaces of poly(tetrafluoroethylene), PTFE, films by hydrogen plasma and ozone treatment and atom transfer radical polymerization. The epoxide groups of the PGMA chains were further reacted with acetic acid (AAc), oxalic acid (XAc), allyl amine (AA), and ethylenediamine (EDN) to introduce hydroxyl and amine groups to the surfaces of the PTFE films. Surface characterizations performed by Fourier Transform infrared attenuated total reflectance (FTIR-ATR) spectroscopy and X-ray photoelectron spectroscopy (XPS) confirmed the surface modification and the chemical structure. The PGMA chains in arborescent structures show a high effectiveness for the enhancement of the adhesion of PTFE films. The adhesion of PTFE films was also significantly enhanced by ring-opening reactions of the PGMA epoxide groups with acetic acid and amine compounds. A high value of 9.5 N cm(-1) in the optimum 180 degrees peel strength test was observed with PTFE/copper assemblies.

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Enhanced Cu-Teflon adhesion by presputtering prior to the Cu deposition

Abstract: Target presputtering effects on stoichiometry and deposition rate of YBaCuO thin films grown by dc magnetron sputtering Appl. Phys. Lett. 52, 1907Lett. 52, (1988; 10.1063/1.99740 Enhanced CuTeflon adhesion by presputtering treatment: Effect of surface morphology changes

Cited by 116 publications

References 19 publications

Fluoride ions at the Cu–fluoropolymer interface

Fluoride ions at the Cu–fluoropolymer interface

Microfabrication of polytetrafluoroethylene using SR direct etching

Effects of Polymer Architecture and Composition on the Adhesion of Poly(tetrafluoroethylene)

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