Enhanced antistatic properties of polyethylene film/polypropylene-coated non-woven fabrics by compound of hot-melt adhesive and polymer antistatic agent

Abstract

In this paper, the compound hot-melt adhesives were prepared by blending alkyl sulfonate polymer antistatic agent with modified rosin hot-melt adhesive and used for the preparation of polyethylene film/polypropylene-coated non-woven fabrics. The effects of the amount of antistatic agent on the melt viscosity, softening point, and thermal stability of the compounded hot-melt adhesives were studied. Then, the antistatic properties and its washing fastness of the coated non-woven fabrics were tested and analyzed. The results showed that the softening point and the melt viscosity of the hot-melt adhesives decreased after compounding, and the thermal stability of the compound hot-melt adhesives decreased in the high temperature range, which was not affected before 200℃. The surface inductive voltage, half-life, and specific resistance of the coated non-woven fabrics prepared from the compound adhesives decreased gradually with the increase of the amount of the antistatic agent, indicating that the antistatic property of the prepared fabrics was gradually improved. In addition, the fabrics still exhibited antistatic properties after soaping for several times. The influence of compound adhesive on the wettability of fabric surface was consistent with that of antistatic property. Finally, the mechanism of the hot-melt adhesive and antistatic agent compounding technology to improve the antistatic performance of the coated non-woven fabrics was elaborated, and the reason for its excellent soaping durability was also explained.

An intrinsic antistatic polyethylene glycol‐based solid–solid phase change material for thermal energy storage and thermal management

“…Like other conventional organic oligomers and polymers, PEG is not a good antistatic material, which would cause the accumulation of static electricity and electrostatic discharge when used for the thermal storage and thermal management of electrical devices, resulting in the performance degradation, even malfunction of the apparatuses. 26,27 In order to render good antistatic property to organic oligomers and polymers, antistatic agents such as carbon materials, surfactants and ionic liquids are added into the host materials. 28,29 Oyama and coworkers used glassy carbon (GC) as the antistatic agent to reduce the electrical resistance of low-density polyethylene (LDPE).…”

Research progress of antistatic‐reinforced polymer materials: A review

“…Moreover, static electricity can lead to the dust absorption in medical apparatus, which finally will affect the accuracy of results. [1][2][3][4] To deal with various problems caused by static electricity, many antistatic methods and antistatic polymer materials have been designed and developed. Such as, reducing the generation of static electricity by electrical grounding, increasing air conductivity or increasing air humidity, 5 introducing conductive layers by chemical plating in the surface of the polymer materials, 6 grafting with hydrophilic or conductive materials onto polymer materials, 7,8 copolymerizing monomer of polymer with antistatic monomer, 9 and applying antistatic coating on polymer materials surface.…”

“…The presence of static electricity in electronic devices can easily result in circuit failure, device malfunction. Moreover, static electricity can lead to the dust absorption in medical apparatus, which finally will affect the accuracy of results 1–4 …”

Single-Side Superhydrophobicity in Si3N4-Doped and SiO2-Treated Polypropylene Nonwoven Webs with Antibacterial Activity

“…It is well-known that nonwoven surgical gown materials are typically finished with “three repellent and antistatic/directional water-transfer” to endow them with both performance and comfort [ 12 , 13 ]. The nonwovens can also be finished so as to make the inner side close to the skin possess a higher hydrophobicity, providing an effective means of achieving unidirectional moisture transfer [ 14 , 15 ].…”