Energy-release rate and crack kinking in anisotropic brittle solids

Azhdari, Abbas; Nemat‐Nasser, Sia

doi:10.1016/0022-5096(96)00012-9

Cited by 57 publications

(14 citation statements)

References 13 publications

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“…However, in order to define critical micropotential energy parameters of the proposed fracture model, critical strain energy release rates G ζ=0 and G ζ=π/2 are required. They were calculated, consistently with elastic moduli adopted for cortical bone, by energy-release rate proposed in [63] for a collinear extension of a pre-existing crack on one plane of material symmetry of an orthotropic material subjected to the loading conditions here considered…”

Section: Fracture and Damage Sensing In Conductive Materialsmentioning

confidence: 99%

A continuum-molecular model for anisotropic electrically conductive materials

Diana

Carvelli

2021

International Journal of Mechanical Sciences

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Section: Fracture and Damage Sensing In Conductive Materialsmentioning

confidence: 99%

A continuum-molecular model for anisotropic electrically conductive materials

Diana

Carvelli

2021

International Journal of Mechanical Sciences

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“…An energy-based failure criterion was firstly introduced by Foster et al [115] for isotropic materials in the theoretical framework of state-based peridynamics. Such approach was then adapted to pair potentials based continuum-molecular models with non-central interactions by Diana and Ballarini [40] for modeling fracture in orthotropic elastic materials with theoretically uniform resistance to fracture [116]. Orientation dependent fracture energy within a mechanism-based energetic failure criterion accounting for different degrees of anisotropy has been introduced instead in [72], and the resulting model successfully applied to the study of crack propagation in cortical bone tissues.…”

Section: Elastic Behavior Of Architected Meterialsmentioning

confidence: 99%

Anisotropic Continuum-Molecular Models: A Unified Framework Based on Pair Potentials for Elasticity, Fracture and Diffusion-Type Problems

Diana

2022

Arch Computat Methods Eng

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This paper presents a unified framework for continuum-molecular modeling of anisotropic elasticity, fracture and diffusion-based problems within a generalized two-dimensional peridynamic theory. A variational procedure is proposed to derive the governing equations of the model, that postulates oriented material points interacting through pair potentials from which pairwise generalized actions are computed as energy conjugates to properly defined pairwise measures of primary field variables. While mass is considered as continuous function of volume, we define constitutive laws for long-range interactions such that the overall anisotropic behavior of the material is the result of the assigned elastic, conductive and failure micro-interaction properties. The non-central force assumption in elasticity, together with the definition of specific orientation-dependent micromoduli functions respecting material symmetries, allow to obtain a fully anisotropic non-local continuum using a purely pairwise description of deformation and constitutive properties. A general and consistent micro-macro moduli correspondence principle is also established, based on the formal analogy with the classic elastic and conductivity tensors. The main concepts presented in this work can be used for further developments of anisotropic continuum-molecular formulations to include other mechanical behaviors and coupled phenomena involving different physics.

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“…e.g. Azhdari and Nemat-Nasser (1996). The kinking is affected both by the ratio between shear and tensile stresses at the crack tip, Lawn (1995), and the stress oriented parallel to the crack faces (T-stress), see Cotterell and Rice (1980) and Gao and Chiu (1992).…”

Section: Introductionmentioning

confidence: 99%

A new approach for handling and transferring of thin semiconductor materials

Bagdahn¹,

Knoll²,

Wiemer

et al. 2003

Microsystem Technologies

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Based on the fracture mechanics analysis of crack propagation, the phenomenon of subcritical crack growth was utilized for a controlled debonding of directly wafer-bonded interfaces. The approach allowed the well-defined separation of bonded wafers although the bond strength was high due to thermal annealing. The achieved splitting velocity depended on the wafer material, the wafer thickness ratio, the bonding process parameters, and the environmental conditions during cleaving. In combination with wafer bonding, the method can be used for a temporary stiffening and handling of thin and brittle wafers during fabrication, even if the wafers are exposed to high process temperatures. The approach can also be applied to fabricate micromechanical systems (MEMS

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Energy-release rate and crack kinking in anisotropic brittle solids

Cited by 57 publications

References 13 publications

A continuum-molecular model for anisotropic electrically conductive materials

A continuum-molecular model for anisotropic electrically conductive materials

Anisotropic Continuum-Molecular Models: A Unified Framework Based on Pair Potentials for Elasticity, Fracture and Diffusion-Type Problems

A new approach for handling and transferring of thin semiconductor materials

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