Energy-Mode Adjustment in Laser Processing a Small Vitrified CBN Grinding Wheel

Wang, Xu Yue; Wu, Yong Bo; Kang, Ren Ke; Wang, Jun; Xu, Wen Ji; Kato, Masana

doi:10.4028/www.scientific.net/kem.291-292.177

Cited by 6 publications

(6 citation statements)

References 7 publications

(7 reference statements)

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“…Energy absorption and conduction models were developed by Wang et al (2005a), Wang et al (2005b), Wang et al (2005c) and Wang and Wang (2003), which take into account the laser energy absorbed by the surface of the wafer. It is assumed that the laser energy is absorbed by the entire material in the element in accordance with the energy balance equation.…”

Section: Finer Finite Element Methodsmentioning

confidence: 99%

A Threshold Model for Laser Cleaning of Larger Silicon Wafers

Wang¹,

Kang²,

Xu³

et al. 2011

Machining Science and Technology

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& High cleaning quality for silicon wafers without damage is a challenge in laser cleaning technologies. Laser cleaning of Al 2 O 3 micro-particles, which are the main contaminants of silicon wafer lapping and polishing solutions used in industry, from silicon wafers was studied for determining laser energy for high efficient particle removal while not causing damage to the wafers. As the cleaning force is generated from laser-energy absorption and conduction of the wafer, heat-conduction model on silicon wafer was developed during laser irradiation using a finer finite element method, from which cleaning force exerting on the particles greater than the adhesion force between the particle and the substrate, but less than the wafer damage energy of laser input was determined. Calculations of the laser energy threshold values for both particle cleaning and wafer damage were conducted for silicon wafers of 200 mm in diameter and 0.2 mm in thickness, and they were found to be about 60 mJ=cm 2 and 320 mJ=cm 2 , respectively. The laser energy threshold model was finally verified experimentally using a KrF Excimer laser and found to be in good agreement with the experimental data. With the cleaning parameters from the model, the cleaning efficiency of as high as 98% has been achieved.

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Section: Finer Finite Element Methodsmentioning

confidence: 99%

A Threshold Model for Laser Cleaning of Larger Silicon Wafers

Wang¹,

Kang²,

Xu³

et al. 2011

Machining Science and Technology

Self Cite

View full text Add to dashboard Cite

show abstract

“…For laser conditioning of wheels, the tangential irradiation and the radial irradiation are two typical configurations. Research from Wang et al [19,26] showed that the absorbed energy of grinding wheels changed significantly at different radial positions and incident angles, because the space distribution of absorbed and scattered energy was far more different during laser irradiation. Therefore, the laser head should move along with the grinding wheel axis in order to keep the focus offset constant.…”

Section: Introductionmentioning

confidence: 99%

Micro-grooving of brittle materials using textured diamond grinding wheels shaped by an integrated nanosecond laser system

Geng

Tong

Huang

et al. 2022

Int J Adv Manuf Technol

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Freeform surfaces including both the aspherical and prismatic concave/convex have been widely utilized in optical, electronical, and biomedical areas. Most recently, it is reported that grinding with structured wheels provides new possibility to generate patterns on hard and brittle materials. This paper reports the latest research progress on micro-grooving glass ceramic using laser structured diamond grinding wheels. A nanosecond pulse laser is firstly integrated into an ultra-precision machine tool and used for the in-line conditioning of super abrasive grinding wheels, i.e., truing, dressing, and profiling/texturing. Meanwhile, an offset compensation method, considering the shifting depth of focus (DoF) at different laser irradiation positions, is proposed to accurately generate various profiles on the periphery of the grinding wheels. Three types of patterns (riblets, grooves, and pillars) are successfully fabricated on the ceramic substrate using the laser textured grinding wheels. The results indicate that the integrated laser system offers high flexibility and accuracy in shaping super abrasive grinding wheels, and the grinding using textured grinding wheels provides a promising solution to generate functional microstructures on hard and brittle materials.

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“…On the other hand, the tangential irradiation aims to prepare the grinding wheel with more accurate profile. Research from Wang et al [23,30] showed that the absorbed energy for grinding wheels changed significantly at different radial position and incident angle because the space distribution of absorbed and scattered energy was far more different during laser irradiation. Therefore, the laser head should move along with the grinding wheel axis in order to keep the focus offset constant.…”

Section: Introductionmentioning

confidence: 99%

Micro-grooving of brittle materials using textured diamond grinding wheels shaped by an integrated nanosecond laser system

Geng¹,

Tong²,

Zhong³

et al. 2021

Preprint

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The freeform surfaces including both the aspherical and prismatic concave/convex have been widely utilized in optical, electronical, and biomedical areas. Most recently, it is reported that grinding with structured wheels provides new possibility to generate patterns on hard and brittle materials. This paper reports the latest research progress on micro-grooving glass ceramic using laser structured bronze bond diamond grinding wheels. A nanosecond pulse laser is firstly integrated into an ultra-precision machine tool and used for the in-line conditioning of super abrasive grinding wheels, i.e. truing, dressing, and profiling/texturing. Meanwhile, an offset compensation method, considering the shifting depth of focus (DoF) at different laser irradiation position, is proposed to accurately generate various profiles on the periphery of the grinding wheels. Three types of patterns (riblets, grooves, and pillars) are successfully fabricated on the ceramic substrate using the laser textured grinding wheels. The results indicate that the integrated laser system offers high flexibility and accuracy in shaping super abrasive grinding wheels, and the grinding using textured grinding wheels provide a promising solution to generate functional structures on hard and brittle materials.

show abstract

Energy-Mode Adjustment in Laser Processing a Small Vitrified CBN Grinding Wheel

Cited by 6 publications

References 7 publications

A Threshold Model for Laser Cleaning of Larger Silicon Wafers

A Threshold Model for Laser Cleaning of Larger Silicon Wafers

Micro-grooving of brittle materials using textured diamond grinding wheels shaped by an integrated nanosecond laser system

Micro-grooving of brittle materials using textured diamond grinding wheels shaped by an integrated nanosecond laser system

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