“…Examples include application-specific integrated circuits (ASICs), 13 application-specific coating technologies (ASpeCT) 14, 15 , nano/micro electronic/opto mechanical structures (NEMS/MEMS/ MOMS) 16 and optoelectronic integrated circuits (OEICs) 17,18 . The International Technology Roadmap for Semiconductors (ITRS 2.0, see http://www.itrs2.net/itrs-reports.html) calls for '3D Power Scaling' as the next phase of silicon integrated circuit technology.…”