2016 IEEE 8th International Memory Workshop (IMW) 2016
DOI: 10.1109/imw.2016.7495268
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Endurance/Retention Trade Off in HfOx and TaOx Based RRAM

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Cited by 29 publications
(40 citation statements)
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“…The three switching modes are controllable by the CC during the forming and set processes ( Figure S1) [22]. Next, endurance, cumulative probability, and retention are investigated for the 3 different switching modes in the TaO x /HfO 2 memristor to evaluate its reliability and variability [23]. Figure 3a-c show endurance tests for filamentary, interface-type, and pseudo interface-type switching, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…The three switching modes are controllable by the CC during the forming and set processes ( Figure S1) [22]. Next, endurance, cumulative probability, and retention are investigated for the 3 different switching modes in the TaO x /HfO 2 memristor to evaluate its reliability and variability [23]. Figure 3a-c show endurance tests for filamentary, interface-type, and pseudo interface-type switching, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…With present age computing being more and more data driven, there has been demands for a memory technology which is more in-tune with the present and future requirements. Compared to the several emerging devices, RRAM devices are more scalable [ 14 18 ], have high density [ 19 – 24 ], consume low power [ 25 29 ], are faster [ 30 – 33 ], have higher endurance and retention [ 34 37 ] and highly CMOS compatible [ 38 – 42 ]. RRAM devices are one of the most popular non-volatile memory technologies with extensive study being undertaken to understand their mechanism and develop models to realize the device operation and design accurate and simple device structure.…”
Section: Introductionmentioning
confidence: 99%
“…ESISTIVE random access memory (ReRAM) is among the most promising candidates to replace conventional nonvolatile memories for embedded applications [1], [2] owing to its high speed, high endurance, low power consumption, high scalability, and 3D integration feasibility [3]. The devices investigated in this work are 1T1R HfO 2based structures that comply with the above requirements [4]- [6] and that have been thoroughly tested for intercell variability [7], forming conditions [8] and characterized using high speed dynamical techniques [6], [9]. The operational principle of ReRAMs relies on the repetitive formation (low resistance state, LRS) and rupture (high resistance state, HRS) of a conductive pathway spanning the oxide film.…”
Section: Introductionmentioning
confidence: 99%