Endowing Acceptable Mechanical Properties of Segregated Conductive Polymer Composites with Enhanced Filler-Matrix Interfacial Interactions by Incorporating High Specific Surface Area Nanosized Carbon Black

Abstract

Tuning the high properties of segregated conductive polymer materials (CPCs) by incorporating nanoscale carbon fillers has drawn increasing attention in the industry and academy fields, although weak interfacial interaction of matrix-filler is a daunting challenge for high-loading CPCs. Herein, we present a facile and efficient strategy for preparing the segregated conducting ultra-high molecular weight polyethylene (UHMWPE)-based composites with acceptable mechanical properties. The interfacial interactions, mechanical properties, electrical properties and electromagnetic interference (EMI) shielding effectiveness (SE) of the UHMWPE/conducting carbon black (CCB) composites were investigated. The morphological and Raman mapping results showed that UHMWPE/high specific surface area CCB (h-CCB) composites demonstrate an obviously interfacial transition layer and strongly interfacial adhesion, as compared to UHMWPE/low specific surface area CCB (l-CCB) composites. Consequently, the high-loading UHMWPE/h-CCB composite (beyond 10 wt% CCB dosage) exhibits higher strength and elongation at break than the UHMWPE/l-CCB composite. Moreover, due to the formation of a densely stacked h-CCB network under the enhanced filler-matrix interfacial interactions, UHMWPE/h-CCB composite possesses a higher EMI SE than those of UHMWPE/l-CCB composites. The electrical conductivity and EMI SE value of the UHMWPE/h-CCB composite increase sharply with the increasing content of h-CCB. The EMI SE of UHMWPE/h-CCB composite with 10 wt% h-CCB is 22.3 dB at X-band, as four times that of the UHMWPE/l-CCB composite with same l-CCB dosage (5.6 dB). This work will help to manufacture a low-cost and high-performance EMI shielding material for modern electronic systems.

Eco-Friendly Silver Nanoparticles/Chitosan/Poly(vinyl alcohol) Composites Exhibit Remarkable EMI Shielding Capabilities and Outstanding Thermal Conductivities

“…In this context, the scientific community and business have shown considerable interest in innovative polymer matrix composites including conductive fillers . Conventionally, polymers are poor conductors for phonons and electrons, , conversely, the thermal conductivity and EMI shielding performance of polymers can be enhanced by adding thermally and electrically conductive fillers such as carbon nanofibers (CNFs), , graphene nanosheets (GNs), ,,, silver nanoparticles (Ag NPs), − silver nanowires (Ag NWs), ,, copper nanoparticles (Cu NPs), MXenes, , etc. Low-filled fillers are not enough to form a continuous transmission path of phonons and electrons, while high-filled fillers will inevitably weaken the mechanical strength and processing ability of polymer-based composites .…”

“…Lee et al fabricated Cu/Ag-plated polystyrene (PS) particles and hot-pressed them to form 3D Cu/Ag shell networks. Cheng et al employed high-speed mechanical stirring combined with hot-pressing to blend ultrahigh-molecular-weight polyethylene (UHMWPE) particles and nanosized carbon black (CCB). Due to the unique rheology of UHMWPE, CCB can form a 3D conductive path between the UHMWPE particles .…”