2018 International Wafer Level Packaging Conference (IWLPC) 2018
DOI: 10.23919/iwlpc.2018.8573263
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Enabling Reliability of 3D TSV Advanced Packages with Nonconductive, Pre-Applied Underfill Film Materials

Jie Bai
1
,
Kail Shim
2
,
James J. Jang
3
et al.
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