SAE Technical Paper Series 2008
DOI: 10.4271/2008-01-2919
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Enabling Much Higher Power Densities in Aerospace Power Electronics with High Temperature Evaporative Spray Cooling

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Cited by 5 publications
(3 citation statements)
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“…Results indicated that the IGBT module could safely operate at a heat flux up to 140 W/cm 2 while maintaining the junction temperature below 125 • C. Then, they also tested the spray cooling system with 95 • C water as a coolant for thermal management of hybrid propulsion systems of aircraft. It was found that the temperature of IGBT cooled by a water spray was about 10 • C lower than the water-propylene glycol mixture [109]. Recently, Siddiqui et al [110] investigated the spray residue surface effects of the hybrid nanofluid on the spray cooling performance.…”
Section: Spray Coolingmentioning
confidence: 99%
“…Results indicated that the IGBT module could safely operate at a heat flux up to 140 W/cm 2 while maintaining the junction temperature below 125 • C. Then, they also tested the spray cooling system with 95 • C water as a coolant for thermal management of hybrid propulsion systems of aircraft. It was found that the temperature of IGBT cooled by a water spray was about 10 • C lower than the water-propylene glycol mixture [109]. Recently, Siddiqui et al [110] investigated the spray residue surface effects of the hybrid nanofluid on the spray cooling performance.…”
Section: Spray Coolingmentioning
confidence: 99%
“…Their spray cooling approach removed heat fluxes of up to 148 W/cm 2 without exceeding IGBT junction temperature of 125°C, greatly reduced the overall thermal resistance, and increased inverter power level up to 3.4X compared to conventional cold plates. Later, Turek et al [18] conducted experiments with pure water using the same setup, and found that water, at similar subcooling levels, provides several o C lower temperatures over the WPG. They concluded that the vapor generated by WPG boiling is nearly all water, leaving a higher concentration mixture at the surface, and resulting a local boiling point increase that diminishes the boiling performance.…”
Section: Introductionmentioning
confidence: 99%
“…They reached a maximum heat flux of 263 W/cm 2 with 33 o C liquid and kept the simulated chip below 125 o C. Their pressure atomized nozzle used 0.78 L/min-cm 2 flow rate at 144 kPa pressure drop. Turek et al [9,10] also evaluated the capabilities of spray cooling for power inverter applications. They replaced the single phase liquid cooled base plate of a COTS power inverter module with a custom made base plate and integrated a spray nozzle array as illustrated in Fig.…”
Section: Introductionmentioning
confidence: 99%