EMR signature analysis for health monitoring and early stage fault diagnosis of IGBT

Biswas, Rajashree; Routray, Aurobinda; Sengupta, Sabyasachi; Pramanik, Meghabriti; Gupta, Arvind Kumar

doi:10.1109/iecon.2017.8216871

Cited by 7 publications

(1 citation statement)

References 25 publications

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“…Studies have shown that electromagnetic interference (EMI) signals can also be used as electrical parameters for aging monitoring [9]. In [10], the IGBT chip is simulated as a magnetic dipole, and radiated interference signal is emitted into space. When the radiation interference signal is captured by the near-field coil, the different operation states of the chip can be judged according to the difference of the interference signal.…”

Section: Introductionmentioning

confidence: 99%

Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module

Chu

Dong

et al. 2021

IEEE Trans. Device Mater. Relib.

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This paper presents an on-line monitoring method of IGBT module bond wires aging based on the phase-frequency characteristics (PFCs) of differential mode (DM) interference signal. Firstly, the collector current variation during IGBT chip switching is analyzed, and the relationship between the aging degree of bond wires and the PFCs of DM interference signal is studied; Secondly, a phase angle characteristic measurement system of DM interference signal is built and used to online monitor the aging of bond wires in IGBT module; Finally, taking the buck converter composed of IGBT module as the equipment under tested, the interference signal is extracted by the RF current probe and processed by the low-pass filter and signal amplifier, then the phase angle characteristics are measured by the oscilloscope board to realize the on-line monitoring of the bond wires aging of IGBT module. The experimental results show that compared with buck converter with healthy IGBT module, the phase angle of DM interference signal in Buck Converter with aging IGBT module is reduced. The proposed method does not need expensive equipment such as spectrum analyzer, and only needs to monitor the aging state of bond wires in IGBT module online through oscilloscope board. Besides, the research method in this paper provides an approximate linear monitoring method for bonding wire lift-off.

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Section: Introductionmentioning

confidence: 99%