EMI/EMC in printed circuit boards-a literature review

Gravelle, Luc B.; Wilson, Perry F.

doi:10.1109/15.135623

Cited by 64 publications

(25 citation statements)

References 40 publications

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“…In dense circuits with high operative signal bandwidths, electromagnetic coupling (crosstalk) between closely spaced signal lines limits interconnect performance [18] and becomes an important aspect of circuit design [19]. Parametric macromodeling techniques that take into account design parameters in addition to frequency (or time) are needed to perform these design activities efficiently, as their realization by full electromagnetic simulations on the entire parameter space is often computationally expensive.…”

Section: Introductionmentioning

confidence: 99%

Parameterized models for crosstalk analysis in high-speed interconnects

Ferranti

Dhaene

Knockaert

et al. 2009

2009 IEEE International Symposium on Electromagnetic Compatibility

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Abstract-We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs), that is suitable to interconnect modeling. It is based on a recently introduced spectral approach for the analysis of lossy and dispersive MTLs extended by utilizing the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. They can handle design parameters, such as substrate or geometrical layout features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to carry out design space exploration, design optimization and crosstalk analysis efficiently. A numerical example validates the proposed approach in both frequency and time domain and is focused on the crosstalk analysis.

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Section: Introductionmentioning

confidence: 99%

Parameterized models for crosstalk analysis in high-speed interconnects

Ferranti

Dhaene

Knockaert

et al. 2009

2009 IEEE International Symposium on Electromagnetic Compatibility

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“…Given a solution to this equation, the E field can be computed using Equation (3) and then the D field computed using Equation (2). At this point, all of the fields surrounding the device are known, can be visualized, and can be used to calculate the transmission line parameters.…”

Section: Governing Equationsmentioning

confidence: 99%

“…More functions can be fit into the same amount of space, products with novel form factors can be more easily manufactured, interconnect can be routed more smoothly, interfaces can be better implemented, electrical and mechanical functions can be comingled, and entirely new device paradigms will be invented. When we depart from traditional planar topologies, however, many new problems arise like signal integrity, crosstalk, noise, and unintentional coupling between devices [2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Isolation of a Microstrip by Embedding in a Spatially Variant Anisotropic Metamaterial

Rumpf¹,

Garcia

Tsang

et al. 2013

PIER

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Abstract-The near-field surrounding devices can be arbitrarily sculpted if they are embedded in a spatially variant anisotropic metamaterial (SVAM). Our SVAMs are low loss because they do not contain metals and are extraordinarily broadband, working from DC up to a cutoff. In the present work, a microstrip transmission line was isolated from a metal object placed in close proximity by embedding it in a SVAM so that the field avoided the object. Our paper begins by outlining a simple model for studying transmission lines embedded in SVAMs. We then present our design and experimental results to confirm the concept.

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“…Radiated emissions standards typically cover the range of frequencies from 30 MHz to 1 GHz, and the lower limit is broadened to 0.15 MHz for conducted emissions. 1 The limits on the maximum acceptable levels of conducted and radiated emissions have been guided in many digital electronic equipments, approximately 10 dB attenuation in the frequency range of 30 MHz-1 GHz. 2 Previously, many types of ferromagnetic metal particles and thin films have been proposed as near-field noise absorbing materials in planar transmission lines.…”

mentioning

confidence: 99%

Hybrid absorbers composed of Fe3O4 thin film and magnetic composite sheet and enhancement of conduction noise absorption on a microstrip line

Kim

2015

Journal of Applied Physics

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In response to develop wide-band noise absorbers with an improved low-frequency performance, this study investigates hybrid absorbers that are composed of conductive Fe3O4 thin film and magnetic composite sheets. The Fe3O4 films prepared via reactive sputtering exhibit a typical value of electrical resistivity of ≃10−4 Ωm. Rubber composites with flaky Fe-Si-Al particles of a high permeability and high permittivity are used as the magnetic sheet functioning as an electromagnetic shield barrier. Microstrip lines with a characteristic impedance of 50 Ω are used to measure the noise absorbing properties. For the Fe3O4 film with a low surface resistance and covered by the magnetic sheet, approximately 80% power absorption can be obtained at 1 GHz, which is significantly higher than that of the original magnetic sheet or Fe3O4 film. The high power absorption of the hybrid absorber is attributed to the enhanced ohmic loss of the Fe3O4 film through increased electric field strength bounded by the upper magnetic composite sheet. The noise absorption is further enhanced through increasing the electrical conductivity of the film containing more conductive phase (Fe3O4 + Fe), which can be prepared in a reduced oxygen partial pressure during reactive sputtering.

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EMI/EMC in printed circuit boards-a literature review

Cited by 64 publications

References 40 publications

Parameterized models for crosstalk analysis in high-speed interconnects

Parameterized models for crosstalk analysis in high-speed interconnects

Electromagnetic Isolation of a Microstrip by Embedding in a Spatially Variant Anisotropic Metamaterial

Hybrid absorbers composed of Fe3O4 thin film and magnetic composite sheet and enhancement of conduction noise absorption on a microstrip line

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