Emerson, L(uther) O(rlando)

New Generalized Method for the TEM Examination of Buried Interfaces with Application to the Copper Bond Wire - Aluminum Pad System

“…These metals are prone to smearing [1] and the polished cross section does not lend itself to phase identification, though it does seem reasonable to expect that Electron Backscattered Diffraction (EBSD), could be applied to the phase ID problem, at least in principle. Additionally, there is a very recent publication [3] in which outstanding metallographic cross sections of the Cu wire -Al bond pad interface are presented . Unfortunately, the authors we not at liberty to disclose the proprietary chemistry and techniques used in their method.…”