2010 Asia-Pacific International Symposium on Electromagnetic Compatibility 2010
DOI: 10.1109/apemc.2010.5475514
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EMC modelling of dual die CPU with a heatsink

Abstract: This paper presents an EMC modelling approach for the latest dual die CPU with a heatsink from an antenna point of view. The model acts as a very efficient antenna while its structure is constructed almost according to a real dual die CPU structure. Different sizes of heatsink cooperate in the investigation of electromagnetic characterization. Simulation and measurement are accomplished in far-filed range. The results show that the dual die model without heatsink is resonating at two frequencies which are 2.04… Show more

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