Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler

Bae, Daniel G.; Mandel, Raphael; Dessiatoun, Serguei; Rajgopal, Srihari; Roberts, Samantha P.; Mehregany, Mehran; Ohadi, Michael M.

doi:10.1109/itherm.2017.7992511

Cited by 22 publications

(10 citation statements)

References 11 publications

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“…Advantageous heat transfer topologies for semiconductor thermal management include high surface area to volume ratios, surface features that promote mixing for heat transfer enhancement, and short flow paths for minimal pressure drop. High surface area to volume features can be realized by fabricated microscale features, including microchannels, in the heat transfer surface via deep reactive ion etching [49,50], microdeformation [51,52], and additive manufacturing [53,54]. Additive manufacturing has also repeatedly shown excellent utility in forming complex fluid manifolding paths for high heat flux electronics [53,55].…”

Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

“…Pumped two-phase cooling is advantageous because it can remove more heat per pumping power than single-phase pumped cooling when configured correctly, and heat transfer coefficients generated by two-phase flows are considerably larger than those of single-phase flows under typical cooling conditions [29,58]. Further design possibilities for very high heat transfer coefficients include solid-liquid phase change materials, spray cooling, liquid metal cooling, and thermoelectric cooling [50,59,60].…”

Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

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Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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Enhanced cooling, coupled with novel designs and packaging of semiconductors, has revolutionized communications, computing, lighting, and electric power conversion. It is time for a similar revolution that will unleash the potential of electrified propulsion technologies to drive improvements in fuel-to-propulsion efficiency, emission reduction, and increased power and torque densities for aviation and beyond. High efficiency and high specific power (kW/kg) electric motors are a key enabler for future electrification of aviation. To improve cooling of emerging synchronous machines, and to realize performance and cost metrics of next-generation electric motors, electromagnetic and thermomechanical co-design can be enabled by innovative design topologies, materials, and manufacturing techniques. This paper focuses on the most recent progress in thermal management of electric motors with particular focus on electric motors of significance to aviation propulsion.

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Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Section: Lessons From High-performance Electronicsmentioning

confidence: 99%

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Deisenroth

Ohadi

2019

Energies

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“…Manifolded microchannel (MMC) geometries, of the type shown in Fig. 17, have demonstrated the ability to remove high heat fluxes while maintaining modest pressure drops (less than 100 to 200 kPa at the highest heat fluxes) in embedded cooling applications [63]. MMC geometries are a matrix of parallel microgap channels, fed by larger out-of-plane liquid channels interspersed with even larger vapor channels acting as chimneys for escaping vapor.…”

Section: Centripetal Acceleration In Manifold-fed U-shaped Microgap Channelsmentioning

confidence: 99%

“…A recent heat transfer study with embedded MMC's in a silicon carbide (SiC) test chip removed 1 kW of heat from a 1 cm 2 chip with R245fa flowing at 1400 kg/m 2 -s, with an estimated inlet pressure of 400 kPa [63]. The flow was split into 10 inlets and 11 outlets for 500 microgrooves, forming 10,000 U-shaped microgap flow paths.…”

Section: Centripetal Acceleration In Manifold-fed U-shaped Microgap Channelsmentioning

confidence: 99%

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Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow

Bar‐Cohen

Robinson

Deisenroth

2018

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present "remote cooling" paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/cm 2 , but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), twophase cooling in intra-and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year "inward migration" of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with "remote" or attached air-and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from singlephase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior. Keywords-embedded cooling; electronics cooling; two-phase flow; heat transfer; microgap; microchannelRecent studies [27][28][29][30][31][32][33] of two-phase thermofluid behavior in relatively long (100 < / < 500) microgap channels have uncovered a strong dependence of the previously observed Mshape variation in heat transfer coefficient, as seen in Fig. 4, on the prevailing two-phase flow regimes. The low-quality peak in

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An Aerosol Jet Printed Resistance Temperature Detector‐Micro Hotplate with Temperature Coefficient of Resistance Stabilized by Electrical Sintering

Sui

Tsui

Thibodeaux

et al. 2023

Adv Materials Technologies

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Aerosol jet printing (AJP) is an emerging direct write tool enabling rapid prototyping and fabrication of electronics components. AJP provides faster and less expensive production of devices with feature sizes of >10 microns compared to traditional MEMS processes. Herein, the fabrication of a resistance temperature detector‐micro hotplate (RTD‐µHP) is reported using AJP printed silver. AJP eliminates sophisticated MEMS processes such as masking, alignment, and etching. The compatibility of the AJP process with a broad range of materials is demonstrated by printing highly resolved lines on rigid and flexible substrates. Optimal thermal sintering conditions of AJP printed silver (Ag) lines are found by in situ resistance measurements. To stabilize the temperature coefficient of resistance (TCR) of the RTD‐µHP at high operating current levels, electrical sintering is performed on the RTD‐µHPs. Electrical sintering improves the conductivity of fully thermally sintered Ag RTD‐µHPs by 32% and provides a burn‐in mechanism for stabilizing the TCR. The TCR of the RTD‐µHPs after electrical sintering is 3.80 × 10−3 at 22 °C, close to the value for bulk Ag. The performance of the RTD‐µHPs is tested using a reference thermocouple. The RTD‐µHPs show reliable and repeatable heating and temperature sensing up to 70 °C in air.

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Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler

Cited by 22 publications

References 11 publications

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Thermal Management of High-Power Density Electric Motors for Electrification of Aviation and Beyond

Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow

An Aerosol Jet Printed Resistance Temperature Detector‐Micro Hotplate with Temperature Coefficient of Resistance Stabilized by Electrical Sintering

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