Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Mandel, Raphael; Dessiatoun, Serguei; McCluskey, Patrick; Ohadi, Michael M.

doi:10.1115/ipack2015-48496

Cited by 19 publications

(12 citation statements)

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“…While liquid-vapor phase-change techniques such as flow boiling in microchannels have been investigated for conductive 7,8 as well as dielectric fluids [9][10][11] , significant limitations associated with flow instabilities and power consumption prohibit practical implementation 8,12 .…”

Section: Introductionmentioning

confidence: 99%

Nanoporous membrane device for ultra high heat flux thermal management

et al. 2018

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High power density electronics are severely limited by current thermal management solutions which are unable to dissipate the necessary heat flux while maintaining safe junction temperatures for reliable operation. We designed, fabricated, and experimentally characterized a microfluidic device for ultra-high heat flux dissipation using evaporation from a nanoporous silicon membrane. With~100 nm diameter pores, the membrane can generate high capillary pressure even with low surface tension fluids such as pentane and R245fa. The suspended ultra-thin membrane structure facilitates efficient liquid transport with minimal viscous pressure losses. We fabricated the membrane in silicon using interference lithography and reactive ion etching and then bonded it to a high permeability silicon microchannel array to create a biporous wick which achieves high capillary pressure with enhanced permeability. The back side consisted of a thin film platinum heater and resistive temperature sensors to emulate the heat dissipation in transistors and measure the temperature, respectively. We experimentally characterized the devices in pure vaporambient conditions in an environmental chamber. Accordingly, we demonstrated heat fluxes of 665 ± 74 W/cm 2 using pentane over an area of 0.172 mm × 10 mm with a temperature rise of 28.5 ± 1.8 K from the heated substrate to ambient vapor. This heat flux, which is normalized by the evaporation area, is the highest reported to date in the pure evaporation regime, that is, without nucleate boiling. The experimental results are in good agreement with a high fidelity model which captures heat conduction in the suspended membrane structure as well as non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work suggests that evaporative membrane-based approaches can be promising towards realizing an efficient, high flux thermal management strategy over large areas for high-performance electronics.

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Section: Introductionmentioning

confidence: 99%

Nanoporous membrane device for ultra high heat flux thermal management

et al. 2018

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“…In the pressfit design, all of the components of the test section are held in place with mechanical force, as described in Refs. [15] and [16]; in the bonded design, the number of components is greatly reduced, and the chip and manifold are permanently bonded together using a thin-film soldering technique, as described in Refs. [15], [17], and [18].…”

Section: Experimental Methodsmentioning

confidence: 99%

“…Braces were elongated in the direction of flow to minimize the disturbances to the flow. The alumina manifolds for the press-fit test section were lapped and polished to achieve 1 lm parallelism and 100 nm surface roughness in order to avoid microscopic gaps between the manifold and heat sink that could potentially adversely impact heat transfer and pressure drop [15,19]. The circuit boards were made of both glass, and the metal pattern screen-printed in the laboratory.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…First, the header and manifold are 3D printed as one monolithic structure, and the microchannel fin tips and the manifold are directly bonded together, preventing the possibility of any flow bypassing the microchannels, which was shown in Refs. [15] and [19] to have a significant impact on pressure drop and heat transfer. Second, the use of additive manufacturing enables larger internal flow volume, which, in turn, improves intermicrochannel flow distribution.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…The chips were then bonded to the manifolds using a specially designed bonding device and procedure described in Refs. [15] and [18]. The bonding device was designed to uniformly and The assembled test section was placed into the loop, evacuated from air, and charged with R245fa for RTD calibration.…”

Section: Experimental Methodsmentioning

confidence: 99%

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Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Mandel

Bae

Ohadi

2018

Journal of Electronic Packaging

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The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve maximum benefit, high heat fluxes and vapor qualities should be achieved simultaneously. While many researchers have achieved heat fluxes in excess of 1 kW/cm2, vapor qualities are often below 10%, requiring a significantly large amount of energy spent on subcooling or pumping power, which minimizes the benefit of using two-phase thermal transport. In this work, we describe our recent work with cooling devices utilizing film evaporation with an enhanced fluid delivery system (FEEDS). The design, calibration, and experimental testing of a press-fit and bonded FEEDS test section are detailed here. Heat transfer and pressure drop performance was characterized and discussed. With the press-fit Si test chip, heat fluxes in excess of 1 kW/cm2 were obtained at vapor qualities approaching 45% and a coefficient of performance (COP) approaching 1400. With the bonded SiC test chip, heat fluxes in excess of 1 kW/cm2 were achieved at a vapor quality of 85% and heat densities approaching 490 W/cm3.

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Advancements in data center thermal management

Kalantarpour,

Vafai

2024

Advances in Heat Transfer

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Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Cited by 19 publications

References 0 publications

Nanoporous membrane device for ultra high heat flux thermal management

Nanoporous membrane device for ultra high heat flux thermal management

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Advancements in data center thermal management

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