Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.
DOI: 10.1109/emap.2002.1188863
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Embedded capacitors technology in 2.4 GHz power amplifier with multi-layer printed wiring board (PWB) process

Changsheng Chen
1
,
Shur-Fen Liu2,
Chun-Kun Wu3
et al.
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Cited by 15 publications
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References 7 publications
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Embedded passives technology for Bluetooth application in multi-layer printed wiring board (PWB)

Weng
1
,
Wei
2
,
Wu
3
et al.
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
15
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Embedded passives technology for Bluetooth application in multi-layer printed wiring board (PWB)

Weng
1
,
Wei
2
,
Wu
3
et al.
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
15
0
0
0
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Functional embedded RF circuits on multi-layer printed wiring board (PWB) process

Jow
1
,
Lai
2
,
Weng
3
et al.
Proceedings Electronic Components and Technology, 2005. ECTC '05.
9
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Embedded Passives On Multi-Layer Printed Wiring Board (PWB) for 5GHz Front-end Module

Jow
1
,
Wei
2
,
Lai
3
et al.
56th Electronic Components and Technology Conference 2006
7
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8
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