2021
DOI: 10.1016/j.jaap.2021.105222
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Elucidating multiple-scale reaction behaviors of phenolic resin pyrolysis via TG-FTIR and ReaxFF molecular dynamics simulations

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Cited by 57 publications
(18 citation statements)
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“…TGA analysis was employed to evaluate the thermal stability of PSZ‐PR aerogels and PR aerogel under a nitrogen atmosphere. According to Figure 4 A, both PSZ‐PR aerogels and PR aerogel exhibit thermal degradation behavior similar to regular phenolic resins, displaying three distinct stages (25–400°C, 400–800°C, and 800–1000°C) with diverse reactions occurring during each stage 39 . All aerogels are stable at the low‐temperature stage (below 400°C).…”
Section: Resultsmentioning
confidence: 95%
“…TGA analysis was employed to evaluate the thermal stability of PSZ‐PR aerogels and PR aerogel under a nitrogen atmosphere. According to Figure 4 A, both PSZ‐PR aerogels and PR aerogel exhibit thermal degradation behavior similar to regular phenolic resins, displaying three distinct stages (25–400°C, 400–800°C, and 800–1000°C) with diverse reactions occurring during each stage 39 . All aerogels are stable at the low‐temperature stage (below 400°C).…”
Section: Resultsmentioning
confidence: 95%
“…The list of small molecular fragments selected for removal were chosen to represent the mixture of common fragments found in pyrolysis off-gasses and to sufficiently accelerate the charring process. Dihydrogen, water, carbon monoxide, carbon dioxide and acetylene were noted products in previous experimental and computational studies [29][30][31][32][48][49][50].…”
Section: Methodsmentioning
confidence: 85%
“…Those obtained Si@Cu 2 O particles were then coated with phenolic resin and pyrolyzed. During the pyrolysis process, phenolic resin converted to carbon, and copper metal formed through the redox reaction between Cu 2 O and SiNPs or the pyrolysis products of phenolic resin, such as CO, C 2 H 2 , etc. This resulting copper metal diffuses into the SiNPs because of the high diffusion coefficient of copper in silicon at high temperature, and the voids formed in the original positions of Cu 2 O particles. , Those chemical reaction mechanisms were given by eqs –: …”
Section: Resultsmentioning
confidence: 99%