“…Regarding the uncooled thermal image sensors, some papers present contributions considering area reduction, enhancement of responsivity and sensitivity, signal readout process, image processing, power consumption and noise equivalent temperature difference (NETD) [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. It is desirable to have these sensors integrated into standard CMOS technology to reduce the costs and to facilitate embedding the interface and the readout electronic circuitry [ 1 , 2 , 4 , 5 , 7 , 10 , 11 , 12 , 17 , 18 ]. Among those sensors having some degree of integration, none can be fabricated without changes to the standard CMOS process: breaking some design rules, adjusting process steps/sequence or by performing post-processing steps [ 1 , 2 , 4 , 5 , 7 , 10 , 11 , 12 , 17 , 18 ].…”