1984 International Electron Devices Meeting 1984
DOI: 10.1109/iedm.1984.190634
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Elimination of fixed pattern noise in super-8 format CCD image sensor by the use of epitaxial wafers

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Cited by 8 publications
(12 citation statements)
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“…Similar fixed patterns have been reported for n-channel, fully depleted CCDs [17] and other silicon-based imagers including partially depleted, back-illuminated silicon vidicons [18,19] and front-illuminated commercial CCDs [20,21], Charge Priming Devices [22], and CMOS image sensors [23]. Concentric patterns that represent the error in position location for charged particles in silicon drift detectors have also been reported [24][25][26].…”
Section: Low-level Effects In Uniform Illuminationsupporting
confidence: 71%
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“…Similar fixed patterns have been reported for n-channel, fully depleted CCDs [17] and other silicon-based imagers including partially depleted, back-illuminated silicon vidicons [18,19] and front-illuminated commercial CCDs [20,21], Charge Priming Devices [22], and CMOS image sensors [23]. Concentric patterns that represent the error in position location for charged particles in silicon drift detectors have also been reported [24][25][26].…”
Section: Low-level Effects In Uniform Illuminationsupporting
confidence: 71%
“…The concentric fixed patterns in the imagers mentioned previously have been attributed to lateral electric fields that displace the charge carriers [19,20], recombination centers and crystal defects that affect the amount of charge collected [20,23], and resistivity-induced variations in the potential barrier to the substrate for the imagers that utilize a vertical-overflow drain [21,22]. Of those effects, it is expected that the lateral electric fields will dominate in fully depleted CCDs as is the case for the silicon drift detectors [24][25][26].…”
Section: Low-level Effects In Uniform Illuminationmentioning
confidence: 99%
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“…Heavy metal contamination at surface can be eliminated by avoiding heavy metals usage such as gold and platinum. Microdefects in substrate can be avoided by use of an epitaxial wafer plus intrinsic/extrinsic gettering process [30]. In order to exclude peripheral carriers generated by Generation-Recombination pairs outside of diode region, an additional PN junction isolation ring is applied at the edge of photodiode.…”
Section: High Sensitivity Si Photodiodementioning
confidence: 99%
“…The low noise Si photodiode has been researched for many years for variant applications [30][31][32]. The primary noise sources of Si photodiode are thermal noise and shot noise which is caused by dark current.…”
Section: High Sensitivity Si Photodiodementioning
confidence: 99%