Elimination of extra spring effect at the step-up anchor of surface-micromachined structure

Gill, John; Ngo, Linh Van; Nelson, Phyllis R.; Kim, Chang‐Jin

doi:10.1109/84.661393

Cited by 28 publications

(17 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Interface elements are used to model the contact surface which is the top of the nitride. The rounded edge of the top of the stepup due to conformal deposition, the sloping edge of the bottom of the stepup due to lateral overetch, and the vertical overetching of the nitride under the anchor are modeled [19].…”

Section: B Mechanical Modelmentioning

confidence: 99%

Characterization of contact electromechanics through capacitance-voltage measurements and simulations

Chan¹,

Garikipati²,

Dutton³

1999

J. Microelectromech. Syst.

122

View full text Add to dashboard Cite

-Electrostatically actuated polysilicon beams fabricated in the MUMPs process are studied, with an emphasis on the behavior when the beam is in contact with an underlying silicon nitride dielectric layer. Detailed 2D electromechanical simulations, including the mechanical effects of stepups, stress-stiffening and contact, as well as the electrical effects of fringing fields and finite beam thickness, are performed. Comparisons are made to quasi-2D and 3D simulations.Pull-in voltage and capacitance-voltage measurements together with 2D simulations are used to extract material properties. The electromechanical system is used to monitor charge buildup in the nitride which is modeled by a charge trapping model. Surface effects are included in the simulation using a compressible-contact-surface model. Monte Carlo simulations reveal the limits of simulation accuracy due to the limited resolution of input parameters. [128]

show abstract

Section: B Mechanical Modelmentioning

confidence: 99%

Characterization of contact electromechanics through capacitance-voltage measurements and simulations

Chan¹,

Garikipati²,

Dutton³

1999

J. Microelectromech. Syst.

122

View full text Add to dashboard Cite

show abstract

“…These (Gill et al, 1998), were intended to reduce compliance at the boundaries. Fang et al utilized a SMART process to design a test structure containing embedded oxide (see Fig.…”

Section: Smart Fabrication Module and Simulationmentioning

confidence: 99%

Development of geometrically based fabrication emulator for MEMS micromachining and excimer laser ablation

Chen¹,

Yeh

2008

Journal of the Chinese Institute of Engineers

View full text Add to dashboard Cite

Computer aided design (CAD) is a key point in the development of all engineering products for cost reduction and for accelerating the update of products. Unlike mechanical design, which usually yields truly 3-D objects, the 2-D extruded nature of the microelectromechanical systems (MEMS) fabrication process makes it extremely suitable to be represented using an automatic solid modeling flow. In this paper, the relationship between key MEMS fabrication procedures and their corresponding solid modeling functions are first correlated. Based on these correlations, a fabrication process emulator, called the NCKU Z-Fabricator is subsequently developed to emulate MEMS fabrication, and successful microfabrication examples are demonstrated. Finally, the simulation module for a novel multi-user MEMS platform "SMart" and the non-traditional excimer laser ablation process are designed and demonstrated using the Z-Fabricator. Following the correlation and methodology outlined in this paper, it is expected that users will be able to design their own process emulator to customize their own special fabrication requirements and to reduce the cost of software in a more flexible manner.

show abstract

“…However, the heating effect due to a focused laser beam on the resonant frequency and vibration modes should be considered [5]. Other methods based on laser interferometry [6,7] to inspect the vibrating parameters also do not eliminate the heating effect. Hence a method that does not influence the properties of a test microspecimen seems essential.…”

Section: Introductionmentioning

confidence: 98%

“…Hence it is also essential not to impose undefined loads on a microstructure during the excitation process. Another effective way to load a resonator is to use a piezoelectric system [1,3,6] that can excite a microstructure to higher order modes. In this paper, we adopt an ultrasonic wave excitation that is non-contact and does not impose any load on a test structure.…”

Section: Introductionmentioning

confidence: 99%

Non-contact evaluation of the resonant frequency of a microstructure using ultrasonic wave

Kang

Tay

et al. 2009

Acta Mech Sin

View full text Add to dashboard Cite

This paper presents a novel non-contact method for evaluating the resonant frequency of a microstructure. Firstly, the microstructure under test is excited by ultrasonic waves. This excitation method does not impose any undefined load on the specimen like the electrostatic excitation and also this is the first actual use of ultrasonic wave for exciting a microstructure in the literature. Secondly, the amplitudes of the microstructure are determined by image edge detection using a Mexican hat wavelet transform on the vibrating images of the microstructure. The vibrating images are captured by a CCD camera when the microstructure is vibrated by ultrasonic waves at a series of discrete high frequencies (>30 kHz). Upon processing the vibrating images, the amplitudes at various excitation frequencies are obtained and an amplitude-frequency spectrum is obtained from which the resonant frequency is subsequently evaluated. A micro silicon structure consisting of a perforated plate (192×192 µm) and two cantilever beams (76 × 43 µm) which is about 4 µm thickness is tested. Since laser interferometry is not required, thermal effects on a test object can be avoided. Hence, the setup is relatively simple. Results show that the proposed method is a simple and effective approach for evaluating the dynamic characteristics of microstructures.

show abstract

Elimination of extra spring effect at the step-up anchor of surface-micromachined structure

Cited by 28 publications

References 11 publications

Characterization of contact electromechanics through capacitance-voltage measurements and simulations

Characterization of contact electromechanics through capacitance-voltage measurements and simulations

Development of geometrically based fabrication emulator for MEMS micromachining and excimer laser ablation

Non-contact evaluation of the resonant frequency of a microstructure using ultrasonic wave

Contact Info

Product

Resources

About