Elevating low-emissivity film for lower thermal transmittance

Kou, Rui; Zhong, Ying; Kim, Jeongmin; Wang, Qingyang; Wang, Meng; Chen, Renkun; Qiao, Yu

doi:10.1016/j.enbuild.2019.03.033

Cited by 27 publications

(14 citation statements)

References 14 publications

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“…Firstly, CD is an electrical discharge caused by the ionization of air surrounding a sharp conductor carrying a high voltage. [28][29][30][31][32] It means that the electrode and the to-be-printed substrate is not in contact.…”

Section: Introductionmentioning

confidence: 99%

Corona-Enabled Electrostatic Printing for Ultra-fast Manufacturing of Binder-Free Multifunctional E-Skins

Wang

Kou

Shang

et al. 2021

ACS Appl. Mater. Interfaces

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As essential components in intelligent systems, printed soft electronics (PSEs) are playing crucial roles in public health, national security, and economics. Innovations in printing technologies are required to promote the broad application of high-performance PSEs at a low cost. However, current printing techniques are still facing long-lasting challenges in addressing the conflict between printing speed and performance. To overcome this challenge, we developed a new corona-enabled electrostatic printing (CEP) technique for ultra-fast (milliseconds) roll-to-roll (R2R) manufacturing of binder-free multifunctional e-skins. The printing capability and controllability of CEP were investigated through parametric studies and microstructure observation. The electric field generation, material transfer, and particle amount and size selecting mechanisms were numerically and experimentally studied. CEP printed graphene e-skins were demonstrated to possess outstanding strain sensing performance. The binder-free feature of the CEP-assembled networks enables them to provide pressure sensitivity as low as 2.5 Pa, and capability to detect acoustic signals of hundreds of hertz in frequency. Furthermore, the CEP technique was utilized to pattern different types of functional materials (e.g., graphene and thermochromic polymers) onto different substrates (e.g., tape and textile). Overall, this study demonstrated that CEP can be a novel contactless and ultrafast manufacturing platform compatible with R2R process for fabricating high-performance, scalable, and low-cost soft electronics.

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Section: Introductionmentioning

confidence: 99%

Corona-Enabled Electrostatic Printing for Ultra-fast Manufacturing of Binder-Free Multifunctional E-Skins

Wang

Kou

Shang

et al. 2021

ACS Appl. Mater. Interfaces

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“…14,15 The exothermal reactions would further accelerate as temperature rises, eventually causing thermal runaway when temperature exceeds 110 C-130 C. 16,17 Conventional thermal runaway mitigation (TRM) techniques are usually triggered by a high temperature, for example, the shutdown separators 18,19 and the positive thermal coefficient coatings/additives. [20][21][22] Their reaction rates are relatively slow and the triggering temperatures are typically higher than 125 C, already at the threshold of thermal runaway. Therefore, these TRM methods may not be sufficiently efficient when the LIB cell damage is severe or when the scale of the LIB system is large.…”

Section: Introductionmentioning

confidence: 99%

Mitigating internal short circuit in prismatic lithium‐ion battery pouch cell by using microstructured current collector

Wang

Noelle

et al. 2021

Int J Energy Res

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Safety of lithium-ion battery (LIB) has become a major concern for many large-scale energy storage systems. Particularly, collision-induced internal short circuit (ISC) can trigger thermal runaway of LIB cells in electric vehicles.Our previous study on LIB coin cells suggested that with an appropriate microstructure, the current collector might favorably modify the failure mode of electrodes and drastically reduce the heat generation rate of ISC. In the current study, we scaled up the technique of microstructured current collector and applied it to LIB pouch cells. Through debossing, surface patterns were rapidly generated on large current collector sheets in a controlled manner. Impact tests demonstrated the high effectiveness of the processed current collectors for thermal runaway mitigation.

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“…Glass is widely used in many applications such as optoelectronics, construction and decoration, medicine, automotive, aerospace, and solar energy harvesting [ 1 , 2 , 3 , 4 , 5 , 6 ]. Glass used in building and vehicle windows is often coated with low-emissivity multilayer thin films.…”

Section: Introductionmentioning

confidence: 99%

Nano-Scale Residual Stress Profiling in Thin Multilayer Films with Non-Equibiaxial Stress State

et al. 2020

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Silver-based low-emissivity (low-E) coatings are applied on architectural glazing to cost-effectively reduce heat losses, as they generally consist of dielectric/Ag/dielectric multilayer stacks, where the thin Ag layer reflects long- wavelength infrared (IR), while the dielectric layers both protect the Ag and act as an anti-reflective barrier. The architecture of the multilayer stack influences its mechanical properties and it is strongly dependent on the residual stress distribution in the stack. Residual stress evaluation by combining focused ion beam (FIB) milling and digital image correlation (DIC), using the micro-ring core configuration (FIB-DIC), offers micron-scale lateral resolution and provides information about the residual stress variation with depth, i.e., it allows depth profiling for both equibiaxial and non-equibiaxial stress distributions and hence can be effectively used to characterize low-E coatings. In this work, we propose an innovative approach to improve the depth resolution and surface sensitivity for residual stress depth profiling in the case of ultra-thin as-deposited and post-deposition annealed Si3N4/Ag/ZnO low-E coatings, by considering different fractions of area for DIC strain analysis and accordingly developing a unique influence function to maintain the sensitivity of the technique at is maximum during the calculation. Residual stress measurements performed using this novel FIB-DIC approach revealed that the individual Si3N4/ZnO layers in the multilayer stack are under different amounts of compressive stresses. The magnitude and orientation of these stresses changes significantly after heat treatment and provides a clear explanation for the observed differences in terms of scratch critical load. The results show that the proposed FIB-DIC combined-areas approach is a unique method for accurately probing non-equibiaxial residual stresses with nano-scale resolution in thin films, including multilayers.

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Elevating low-emissivity film for lower thermal transmittance

Cited by 27 publications

References 14 publications

Corona-Enabled Electrostatic Printing for Ultra-fast Manufacturing of Binder-Free Multifunctional E-Skins

Corona-Enabled Electrostatic Printing for Ultra-fast Manufacturing of Binder-Free Multifunctional E-Skins

Mitigating internal short circuit in prismatic lithium‐ion battery pouch cell by using microstructured current collector

Nano-Scale Residual Stress Profiling in Thin Multilayer Films with Non-Equibiaxial Stress State

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