Elevated damping properties of lead-free solders under electric current stressing

Li, Wangyun; Liu, Linqiang

doi:10.1016/j.scriptamat.2022.115230

Cited by 2 publications

(9 citation statements)

References 27 publications

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“…H increase with the increase in current, which is similar to the findings of previous study (Li and Liu, 2023).…”

Section: Resultssupporting

confidence: 92%

“…The activation energy tends to decrease generally as the current Figure 7 The characterization of Sn5Sb under 0 A and 12.0 A increases. This is because the ability of lattice atoms to overcome the energy barrier under bombardment by electrons increases with current stressing (Li et al, 2022), which is consistent with the previous findings (Li and Liu, 2023).…”

Section: Frequency and Electric Current Dependent Damping Behaviorsupporting

confidence: 91%

“…Basing on the TEM characterizations, it is clear that dislocations can be more easily captured in the Sn5Sb solder matrix under current stressing, see Figure 2(a1) and (b1); and the b-SbSn phase in the solder matrix can act as pinning point during the movement of dislocations, see Figure 2, . In other words, the damping properties of Sn5Sb under current stressing can also be understood basing on G-L theory (Li and Liu, 2023). According to equations (s1), ( s3) and (s4) (see online supplementary material), as the dislocation density r increases, strain amplitude damping under current stressing increases consequently.…”

Section: Resultsmentioning

confidence: 99%

“…As the grain boundary is a strongly pinning site (Yang et al, 2022), the decrease in grain boundary makes dislocations easier to move and thus increase energy dissipation, resulting in a higher damping capacity. 2) (Li and Liu, 2023):…”

Section: Frequency and Electric Current Dependent Damping Behaviormentioning

confidence: 99%

“…In addition, the solder joints of serving electronics are also stressed by electric current. Previous studies have shown that the damping properties of Sn-based lead-free solders used in consumer electronics are significantly influenced by electric current stressing and following the G-L theory (Li and Liu, 2023). However, the influence of Joule heating and athermal effects of electric current on damping properties remains unclear, especially on which one is the dominant factor.…”

Section: Introductionmentioning

confidence: 99%

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Electric current stressing enhanced damping properties in Sn5Sb solder

Liu,

Chen,

2024

SSMT

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Purpose The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder. Design/methodology/approach Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution. Findings It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current. Originality/value These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.

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“…H increase with the increase in current, which is similar to the findings of previous study (Li and Liu, 2023).…”

Section: Resultssupporting

confidence: 92%

Section: Frequency and Electric Current Dependent Damping Behaviorsupporting

confidence: 91%

Section: Resultsmentioning

confidence: 99%

Section: Frequency and Electric Current Dependent Damping Behaviormentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%